Used ANELVA ILC 3935S #9044102 for sale

ANELVA ILC 3935S is an industrial sputtering equipment used for conducting thin-film deposition processes. This system utilizes the process of magnetron sputtering—which ensures uniform deposition on a wide array of materials and substrates. As a vacuum-based process, it is capable of depositing high-quality thin films onto a range of materials, such as steel, plastic, glass, ceramics, silicon, and more. It is also known for its high deposition rate, excellent uniformity performance, and long-lasting durability. ILC 3935S is a fully-sealed sputtering unit, featuring an optical window that allows the observation of a single-chamber target within the machine. This chamber is equipped with a turbo-molecular pump to continuously maintain a high rate of vacuum. It is also equipped with a distributed-sputtering-target-area detection tool, allowing for accurate and consistent sputtering. Additionally, the chamber has a gas control asset, offering stable and precise control of argon flow. The model is powered by a high-frequency-power supply, offering plasma generation. It comes with advanced controllers, allowing for accurate control of the processes. The ILC automatically adjusts reactive sputtering power, film thickness, deposition rate, and more, allowing for quick and efficient process control. In addition, the equipment is also equipped with temperature control sensors, capable of quickly distinguishing temperature changes in the chamber. This allows for accurate control of process conditions, allowing for the achievement of high-precision film deposition. Furthermore, the system is designed to meet both safety and environmental regulations, with anti-interference protective devices and a built-in continuous monitoring unit. This helps to ensure the safety of personnel and the environment, while also guaranteeing operational stability. Lastly, ANELVA ILC 3935S is also equipped with an operation-simulation machine, which enables the investigation of various processes. This provides further insight into sputtering behavior, allowing for the optimization of processes for improved performance.