Used BALZERS / EVATEC MSP 1000 #9164752 for sale

BALZERS / EVATEC MSP 1000 sputtering equipment is a high-end system designed for thin film coating on a variety of materials. It is a multi-chamber unit, allowing multiple deposition sources to be used in sputter deposition. This machine is the first of its kind to include a secondary electron emission monitor, ensuring optimal performance. The tool utilizes an auto-eject mechanism, allowing for easy substrate transfer. The asset has four interchangeable sputtering sources, each capable of coating by thickness, composition, or multi-layer deposition. The sources are nitrogen/argon gas combinations and have a sputtering speed up to 24 mbar. EVATEC MSP 1000 has a process reaction chamber with a loadlock that holds up to six substrates at the same time. The model can accommodate up to 500x500 mm substrates and also has the ability to coat larger substrates with additional accessory components. The substrate temperature can be regulated from 25°C to 800°C. The deposition process is monitored and controlled using an advanced microprocessor based control unit. This unit interfaced with a PC, allowing for precise control over deposition parameters. The equipment is built to ensure uniform deposition and reduce contamination, and includes a bellows-sealed gate valve and a vacuum leak detector. The system comes with an optional automatic gas delivery unit, for accurate and convenient control over the gas mixtures. The gas delivery machine is connected to the reaction chamber with a gas line. This line is also connected to the sputter sources, preventing the need for manual gas exchange. The sputter sources have a stepper motor and encoder for precise position control. BALZERS MSP 1000 is a highly advanced sputtering tool for thin film deposition. With its reactive sputtering sources, deposition control features, and safety measures, this asset can handle various types of deposition processes. Its advanced control unit, gas delivery model, and other features ensure accurate and efficient deposition with minimal contamination.