Used CANON / ANELVA C-7100GT #9188155 for sale
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ID: 9188155
Wafer Size: 12"
Vintage: 2007
PVD Gate metal deposition system, 12"
CANON / ANELVA MDX400
Tandem core
Software version: 100902
Upgraded on 2009
Hardware configuration (Fab):
Main system:
Equipment front end module (EFEM)
Quadro load lock
(2) Transfer chambers
Pass chamber (with wafer aligner)
FOUP System:
(2) RORZE Load ports
Handler system:
Transfer robot double end-effector (EFEM)
(2) Wafer handling units dual-arm (Transfer chamber)
ATM Wafer aligner (EFEM)
VAC Wafer aligner (Pass chamber)
Process chamber:
(3) PVD PCM-X Chambers
(2) PVD 2PVD-EX Chambers
PVD 4/5PVD-EX Chamber
Gas heat chamber
Hardware configuration (Subfab / Auxilliary units):
(4) Power distribution racks
Compressor rack with cryo compressor
Control rack for core
(2) Control racks for (2) PVD-EX
Control rack for 4/5 PVD-EX
(3) Control racks for PCM-X
Control rack for gas heat
EES Rack
(3) Chillers
2007 vintage.
CANON / ANELVA C-7100GT is a compact, high-performance sputtering equipment designed for a variety of thin-film deposition applications. The system features a high-speed, precision-controlled DC magnetron sputtering depositor that can be used for a variety of depositions. The sputtering unit is designed to provide an optimal deposition speed and superior substrate quality for advanced thin-film processing. It is capable of creating precise, homogeneous layers on large substrates with precise control over film thickness and composition. The main components of CANON C-7100GT are a source, a substrate holder, a rotary sputter chamber, a vacuum machine, a power unit, a loadlock chamber, and a controller. The source consists of one or more magnetrons with a variety of cathode materials that are used to create the thin layers of material. The substrate holder is capable of handling large substrates of up to 300 mm in diameter and has the ability to rotate and tilt the sample. The rotary sputter chamber rotates the substrate to ensure uniform film deposition. The vacuum tool maintains the working environment and removes the products of the reaction. The loadlock chamber alleviates the fluctuations of the work chamber pressure and temperature. Finally, the controller is responsible for the power supply, the parameters of the reaction, and the monitoring of the sputtering process. ANELVA C-7100GT is suitable for a wide range of thin-film deposition applications such as optical coatings, reflective coatings, antireflective coatings, surface protection coating, nanostructured coating, metallic layer deposition, and encapsulation. It is capable of working with various types of work piece material such as polymeric, metal, ceramic, and composites. It offers precise deposition control with variations as small as 0.2 nm in film thickness. The asset is designed for high throughputs to ensure easy preparation and flexible operation. C-7100GT is a reliable and durable model with a long service life and low maintenance requirements. It features a safety equipment that includes integrated emergency stops and safety features that protect the operator, the components, and the environment. The system is designed to meet recognized safety standards and regulations and offers various options for remote control and monitoring. The unit also offers precise and accurate process optimization and data collection, enabling users to monitor and analyze the results of the thin-film deposition process.
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