Used CANON / ANELVA EVP-36737 #9048856 for sale

CANON / ANELVA EVP-36737 sputtering equipment is a type of technology used to deposit a thin layer of material onto a support surface. This sputtering system consists of a vacuum chamber with an incorporated deposition unit head and an electron gun assembly. The vacuum chamber is designed to allow for the operation of a high vacuum, up to 1.5 x 10-4 Pa. A gate valve, with a water cooling function, can be used to adjust the vacuum pressure inside the chamber, allowing for optimal deposition conditions. The integrated deposition head houses one or more sputtering cathodes, allowing for the deposition of material directly onto the support surface. The sputtering cathodes can be fitted with many different types of targets, to match the material properties of the desired deposition material. The sputtering process consists of the bombardment of the target by an electron beam from the gun assembly, which causes material from the target to sputter off and deposit onto the substrate. The electron gun assembly consists of an electron gun, filament, modifications kit and deflector plates. It is capable of sputtering both metals and dielectrics under high power densities, and can be adjusted both manually and digitally to control the electron beam position and intensity. This allows for the control of the size of the evaporation area and the thickness of the deposited material on the support surface. CANON EVP-36737 sputtering machine has a wide range of applications, including the deposition of coatings on wafers, films and other delicate materials, as well as solar cell and flat panel display production, among many others. It is well-suited for a wide variety of substrates such as automotive parts, electronics, and precision instruments, due to its high level of accuracy and repeatability. Additionally, it offers the user the ability to monitor the deposition process real-time, allowing for more efficient production processes and better control over the quality of the deposited materials. Overall, this sputtering tool can be used to perform a wide range of deposition processes in a reliable and repeatable manner.