Used CANON / ANELVA I-1060SV2+1 #9144048 for sale

CANON I-1060SV2+1 is an automated sputtering equipment used for coating thin films on various substrate materials. This system is equipped with a five-pocket, high-capacity wafer loading chamber that can accommodate up to 10" wafers. The unit uses a multi-faced cathode which can be independently controlled and provides for greater deposition uniformity across the substrates. The machine has two cathodes for both magnetic and e-beam sputtering. The cathode sources include three for carrying out e-beam specific sputtering and two others for regular sputtering. The chamber walls are made from stainless steel and provide an even and uniform distribution of low reactivity noble gases, such as Argon, to the substrate for increased coating uniformity. This tool is able to achieve great uniformity of coatings over the entire substrate by using multiple rotating targets and independent cathodes, delivering uniform films across the substrate surface. The asset also offers remote deposition control to allow for uniformity across the entire substrate. The process can be effectively controlled through the use of stoichiometric targets, and power setting for each cathode can be individually adjusted to control the deposition rate. ANELVA I-1060SV2+1 can achieve high deposition rates with minimal contaminants and superior process uniformity. The model also features temperature controlled heating elements and temperature probes to ensure uniform film deposition. The Cassette Shuttle Transfer equipment is also designed to reduce chamber bottom deposition by performing substrate exchange under vacuum, for increased coating uniformity. In conclusion, CANON / ANELVA I-1060SV2+1 sputtering system is designed for coating thin films onto various substrate materials with greater uniformity. It features two independently-controlled cathodes and rotating targets, as well as remote deposition controls and temperature controlled elements to ensure uniform deposition of the coating. This unit offers high deposition rates with minimal contaminants, all while achieving quality, uniform coatings.