Used CANON / ANELVA ILC 1051 #293821354 for sale

CANON / ANELVA ILC 1051 is a sputtering equipment designed for use in semiconductor processing. It is capable of depositing various materials onto a variety of substrates including oxide, metal, nitride, and organic passivation layers. CANON ILC 1051 also offers the option of using magnetron sputtering technology to deposit films of a wide variety of materials, including titanium, chromium, copper, and aluminum. The system is equipped with an integrated process chamber and a patented load lock unit. This enables the machine to deposit materials on substrates quickly and at a high throughput. Furthermore, the load lock enables multiple substrates to be loaded and unloaded at once without exposing the interior of the chamber to contaminated air. The integrated process chamber is heated uniformly and has a large working area, allowing for the deposition of thin films with varying thickness. It is also capable of producing highly uniform films with precise control over film thickness. The tool is equipped with an adjustable gas flow control board and a sputter pressure monitor. This ensures that the environment within the chamber is kept under control and allows the user to adjust the gas pressure to achieve the desired sputtering rate. The asset is also equipped with a rotation mechanism that allows the substrate to be rotated while the deposition process takes place, helping to reduce uniformity defects due to non-uniform film deposition. The model uses a DC power supply and a multi-plate equipment for controlling the sputtering rate. This enables precise control over the rate of deposition. The DC power supply also enables the system to deposit materials onto a variety of substrate types, including large substrates and substrates of varying thickness. ANELVA ILC-1051 is a reliable and efficient unit that offers a wide range of features and benefits for the semiconductor industry. It is capable of depositing thin films of varying thicknesses onto a variety of substrates with precise control over the sputtering rate. Additionally, it offers a large working area and has an integrated load lock machine for fast substrate loading and unloading, making it an ideal choice for semiconductor processing.