Used CANON / ANELVA ILC 1051 #9220287 for sale

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CANON / ANELVA ILC 1051
Sold
ID: 9220287
Wafer Size: 6"
Sputtering system, 6" Missing parts: Air booster Compressor.
CANON / ANELVA ILC 1051 sputtering equipment is an advanced, high-performance system used in the industrial and research fields for thin film deposition. It is a Computer-Controlled Electrolytic and Mechanical Multi-Axis Reactive Sputtering Unit (CCEMMRS) with a multi-axis ion source and a multi-axis sample stage. The machine is designed for precise and repeatable deposition of thin films by creating an environment in which ions and neutrons interact with the substrate to form a thin film. The tool has a maximum sputtering speed of 100 nanometers per second (nm/s) and the ability to deposit a wide range of materials. CANON ILC 1051 asset is equipped with a multi-axis ion source and a multi-axis sample stage, allowing for precise control of the direction and intensity of the ion beams. The model includes a reactive gas supply, an exhaust equipment, and a computer controlled data acquisition system. The unit has a maximum sputtering speed of 100 nm/s and the ability to deposit a wide range of materials such as metals, alloys, and compounds. The machine allows for control of the energy, angle of incidence, and focusing of the ion beams to achieve highly uniform deposited layers. The tool is composed of both mechanical and computer-controlled components. The mechanical components include a sample stage, an ion source, an exhaust asset, and a reactive gas supply. The ion source is used to generate the ion beam while the sample stage is used to move the substrate to be sputtered. The reactive gas supply provides the ability to add reactive gases to the process while the exhaust model is used to collect any released particles. The computer-controlled components include a data acquisition equipment which provides feedback and data on the sputtering process for process monitoring and control. ANELVA ILC-1051 sputtering system is an industrial-grade unit that is capable of producing uniform, high-quality thin films with excellent control of the energy, angle of incidence, and focusing of the ion beam. The machine is a multi-axis computer controlled electrolytic and mechanical reactive sputtering tool that permits precise deposition of materials on a wide range of substrates. The asset offers precise control of the sputtering process, allowing for the deposition of high-quality thin films with excellent uniformity and adhesion.
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