Used CANON / ANELVA L-410S-FHL #9156826 for sale

CANON / ANELVA L-410S-FHL
ID: 9156826
Sputtering system.
CANON / ANELVA L-410S-FHL is a sputtering equipment used primarily for physical vapor deposition (PVD) applications. This sputtering system consists of a vacuum chamber that employs a low pressure Langmuir-Hinshelwood etch process. This is done in order to create thin, highly uniform layers of material on substrates such as glass, silicon, plastics, and metals. The unit operates in two stages: a primary chamber with an electron gun, and a secondary chamber with a sputtering gun. The primary chamber is outfitted with an electron gun and consists of an acrylic bell jar which is connected to a vacuum pump. The electron gun produces an electron beam that is used to deposit a thin layer of a material. This beam is created by applying a voltage between two metal electrodes. The voltage is generally controlled by a stepper motor. The electrons are accelerated and then collide with the molecules of the target material, causing them to decompose and be propelled onto the substrate. This process results in a conformal coating layer with an equal thickness across the entire surface. The secondary chamber contains a sputtering gun and consists of an acrylic bell jar. This gun is used to sputter a second thin layer of material onto the substrate. The process is similar to the electron gun, but the sputtering gun consists of three electrodes. A negatively charged target material is placed on the anode (positively charged electrode). When a voltage is applied between the anode and the cathode, ions are expelled from the target material which then collide with the substrate, depositing a thin layer of material on it. This process results in a uniform coverage with a very high deposition rate. CANON L-410S-FHL sputtering machine is used in various industries, such as electronics, automotive, and lighting, for its uniform coverage and mild deposition conditions. This tool ensures accuracy and repeatability for a wide range of sputter deposition and PVD processes.
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