Used CANON / ANELVA SPF-313H #9279660 for sale

CANON / ANELVA SPF-313H
ID: 9279660
Sputtering system, Gas: Ar Substrate: InSb Target: Al2O3 (8" cathodes) and DPs 5".
CANON / ANELVA SPF-313H Sputtering Equipment is a highly advanced and versatile laboratory tool, capable of creating and depositing a variety of thin films. It is equipped with a multi-source ion-beam sputtering source, an enclosed process chamber, a six-substrate turntable, and a multi-plasma etching system. This unit is designed for medium to large area thin-film deposition processes. It also allows users to customize their deposition processes, by setting specific parameters for etching, sputtering, and reactive sputtering. The enclosed process chamber houses three separate vacuum chambers. The first is the sputter source chamber where the material to be deposited is placed. A second chamber houses the 6 substrate turntable for the transfer of wafers to and from the sputter source. A third chamber houses the multi-plasma etching machine and peripheral components. The sputter source consists of a high power ion beam source. An absolutely controlled ion consumption ensures sputtered rates remain precise and repeatable. A wide variety of single or multiple layer-films can be coated with the high power of the ion beam sputter source. This power is often essential for reactive sputtering of films such as aluminum, silicon, and contemporary materials. The substrate turntable has a capacity of six substrates and is designed to evenly distribute weight. A low-moment pivot point reduces vibration while increasing stability and accuracy. Additionally, the turntable is easily adjustable and can be used with a variety of substrate sizes and shapes. The ETCH tool is equipped with a helium-based plasma chamber. This is ideal for controlling etching rates when etching of certain polymers, composites, and even metals. The process is precise, offering incredible repeatability and reliability. CANON SPF-313H Sputtering Asset is an excellent choice for medium to large area thin-film deposition processes. It is designed for a wide variety of applications, from metal deposition, to reactive sputtering, to etching and plating. Its combination of high power ion beam source and precise helium plasma chamber provide unparalleled repeatability and control over the process. Furthermore, its large six-substrate turntable offers stability and flexibility. In short, ANELVA SPF-313H is an ideal choice for any laboratory needing a reliable and easy-to-use sputtering model.
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