Used CVC 2800 #9054640 for sale
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ID: 9054640
Cluster tool
Loadlock chamber: ion mill ~50A/min
Heater chamber: HAS, ~250ºC
Chamber 1, (3) targets:
Titanium
Ti-W: 10% wt Titanium to 90%wt Tungsten
Copper
RF Power supply: HAS 1
Chamber 2, (3) Targets:
Copper doped Aluminum, 5%wt
Tantalum
Tantalum
RF power supply: HAS 1
Process gas: (3) mass flow controllers: argon, nitrogen, oxygen
Includes:
(3) CTI 8 Cryo pumps and compressors
Mechanical vacuum pump: Alcatel M2033
Substrate handling options:
6" round substrate pallet capable of holding (8) substrates
8" round substrate pallet capable of holding (6) substrates
Customized 8" to 6" Adaptable Pallet for Edge Protection.
CVC 2800 sputtering equipment is a state-of-the-art, high-performance, in-line deposition system from Cambridge Vacuum Coatings. The unit is designed for the deposition of a wide variety of materials to many substrates. It utilizes a modular design approach that allows for easy customization as needed for process integration and automation. The central manipulation machine of 2800 tool is composed of two sputtering chambers and a coating chamber. Each sputtering chamber is equipped with four magnetron sources and four substrates to maximize deposition rate and throughput. The coating chamber is fitted with a thermal oxidation chamber to improve substrate temperature control and optimize the growth of thin films. The plasma is generated in the sputtering chamber through a paired filament asset in the cathode source. This generates an electron gun that accelerates electrons to the anode source, creating a glow discharge. In the coating chamber, the high-density plasma is generated through a remotely controlled voltage supply which leaves a hot layer of ionised molecules next to the substrate. The sputtered material then condenses on the substrate. CVC 2800 sputtering model is equipped with several features that make it suitable for use in various coating applications. These include easy-to-use automation layers on top of manual chamber-to-chamber control, automatic control of substrate and cathode source parameters, a versatile measurement suite, and a wide range of materials that can be deposited. Additionally, 2800 equipment is capable of operating under high vacuum and at fast pumping speeds. All of these features make CVC 2800 sputtering system the ideal choice for achieving thin film deposition with high precision, repeatability, and high throughput. This makes the unit the go-to choice for many diverse industrial depositions such as medical devices, sensors, displays, and optoelectronics.
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