Used DENTON VACUUM DESK II #9308564 for sale

DENTON VACUUM DESK II
ID: 9308564
Sputtering system Model number: 18314.
DENTON VACUUM DESK II is a sputtering equipment developed for applications such as film deposition and coating surface preparations. It is a powerful, advanced system capable of producing a variety of sputterer configurations, depending on the needs of the user. In addition, this unit is designed for large-scale operations, with its excellent control capabilities and high-efficiency sputtering technology. The main components of the machine include the vacuum chamber, the sputter targets, the power supply, and the RF generator. The vacuum chamber is composed of a stainless steel body that is hermetically sealed and uses an RF tool for maintaining the vacuum level. Inside the chamber, the pressure remains between 5 and 6 mTorr during a deposition process. The power supply provides an electric current to the sputter targets. Its maximum power rating is up to 600 amps. The RF generator is used to produce the high voltage that is used to energize the sputter targets. The unique capabilities of DESK II allow the user to select from a variety of sputter configurations, including single, double, and triple targets. This is beneficial for obtaining sheets, chambers, or complex structures with different types of materials. The user can control the position of the sputter targets, the power supply, and the RF generator, so the deposition of material can be tailored to the desired application. This sputtering asset also features a rotatable viewport, a quartz viewport, and variable speed base rotation. The viewport provides an inside view of the deposition process taking place inside the chamber. The quartz viewport allows the user to monitor the deposition process externally. With the variable speed base rotation, the user can control the sputter targets' position. This allows for a precise and uniform deposition process. In addition, DENTON VACUUM DESK II allows the user to control the substrate temperature and chamber pressure separately. This ensures that the sputtering process can be conducted with minimal contamination and the desired properties of the films can be obtained. Its advanced sputtering technology and excellent control capabilities make it an ideal product for various sputtering operations.
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