Used ELECTROTECH MS 6210 #9396125 for sale

ELECTROTECH MS 6210 is a high-tech sputtering equipment designed for a wide range of applications requiring thin film deposition. This system is an invaluable piece of technology for numerous industries, from semiconductor processing to energy storage. MS 6210 is composed of various components. The major elements include an adjustable RF/DC power supply with an output of up to 1000W and an adjustable high-voltage power supply which may be used to boost power or keep power from exceeding a predetermined level. The unit can be equipped with two 5-inch or 9-inch sputter sources, one 1-inch ion source and one 1-inch rotatable substrate holder. The base of the sputter source is made of aluminum and is designed for nearly silent operation and low heat generation. The temperature of ELECTROTECH MS 6210 can be monitored and controlled via its built-in temperature measurement and control aspect. The sputtering machine has a vacuum chamber capable of holding up to 10-5 torr (.00001 Pascal) of vacuum. The working pressure achievable in the chamber is up to 4 x 10-3 torr. The operation of the sputtering tool is governed by a Windows-based controlling asset accessible via a foot pedal. The sputtering process itself is driven by reactive sputter deposition which uses two low-pressure, RF-coupled sputter sources. Reactive sputter deposition is a method of depositing thin films by sputtering a target material in a controlled atmosphere into a growing thin film on a substrate. This allows for heavily stoichiometric, homogeneous thin films to be built up with high density and total control over film composition. MS 6210 is ideal for depositing C, W, Al, TiN, CrN, Ti, and Ni alloys. Secondary processes such as etching, ion-assisted deposition, and thermal oxidation can be integrated with reactive sputter deposition to enable additional control of film properties such as refractive index, surface texture, and hardness. In conclusion, ELECTROTECH MS 6210 is an extremely versatile sputtering model package which offers excellent control over a range of thin film deposition processes. Its adjustable RF/DC power supply, adjustable high-voltage power supply, temperature measurement and control, integrated vacuum chamber and Windows-based controlling equipment make it a great choice for any sputtering application.