Used EVATEC Radiance 1BPM1 #9160844 for sale
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ID: 9160844
Wafer Size: 2"
Vintage: 2010
Cluster sputter deposition systems, 2"
Load lock and handling module for up to Φ 8"
Substrates on carrier - Carousel 200:
(1) Load lock LL with cassette capable for 8" carriers
Transfer module TM
Fore line pump for TM - EDWARDS GX100L
Includes valves, measuring gauges
Transfer pressure: <8e-3 mbar
Batch process module (BPM) for 14 x Φ 200 mm carrier:
Process chamber for up to (5) integrated process sources
Turn table, adjustable TS distance
Wafer chucks for 200 mm carrier
Fore line pump - EDWARDS GX100L
High vacuum pumping system with isolation valve:
Turbo pump - PFEIFFER High pace 2301
CTI Inline water pump
Chamber conditioning unit (Quartz lamps)
Baratron process gas measurement gauge
Base pressure: <9E-8 mbar
Process sources ARQ for DC sputtering:
Planar magnetron with rotating magnet system
(1) 5 kW DC Power supply high voltage switching unit for up to (5) cathodes
(3) Mass flow controller for process gas
Rack cabinet:
Electric equipment
Control system
(1) Cathode install (LG INNOTEK)
ITO Sputtering
Currently warehoused
2010 vintage.
EVATEC Radiance 1BPM1 is a multi-target, plasma-based thin film deposition sputtering equipment developed and manufactured by the Swiss-based company, EVATEC AG. It offers the latest in innovative technology with a wide range of deposition features and process control options. Radiance 1BPM1 features an advanced plasma source with three electron sources, enabling tight control of substrate temperature, pressure, and gas flow. This technology is used to deposit materials such as metals, dielectrics, polymers, and composite films, with a variety of deposition qualities such as precision of area, depth, and layer thickness. EVATEC Radiance 1BPM1 has several integrated features that facilitate optimal deposition. It includes a Computer Automated Sample Exchange (CASE) system with four sample holders and a multi-position airlock. This design allows for quick and efficient loading and unloading of samples. The unit is also equipped with a rotating sample holder for three-dimensional target sputtering. Radiance 1BPM1's powerful advanced plasma source and integrated process parameters make it ideal for optimizing uniformity and homogeneity of thin films. It is designed to work with both highly reactive and non-reactive materials, yielding optimal results for all types of applications. In addition, the machine features a built-in interlock tool for both target removal and substrate movement, allowing for accurate and repeatable deposition. It also includes safety features such as a gas exhaust fan, fume hood, and external exhaust for the plasma source. The external control panel allows for precise control of process parameters, including gas and film thickness, pressure, and temperature. The parameters can be adjusted in real-time for quick and accurate film deposition. Additionally, the built-in vacuum asset and secondary ions signal permits process monitoring for unprecedented safety and reliability. EVATEC Radiance 1BPM1 offers a comprehensive list of features and technologies that make it the ideal choice for thin film deposition applications. Its advanced plasma source and integrated process parameters provide optimal homogeneity and uniformity of thin films. Its safe and efficient components and features make it the perfect solution for reliable, repeatable, and accurate deposition of materials onto substrates.
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