Used HITACHI E-102 #9078351 for sale
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HITACHI E-102 is a sputtering equipment designed to deposit thin films evenly and with great precision on a variety of substrates. This system utilizes a unique pulse DC sputtering process to achieve an order of magnitude improvement in coverage, uniformity, and root mean square (RMS) roughness compared to conventional sputtering systems. E-102 is built upon a robust stainless steel chamber, which supports a stationary aluminum target and an adjustable mount for the optically clear chamber walls. This mount offers precise angle adjustment and a centerline tilt that helps reduce deposition non-uniformity due to arc discharges. The pulse DC sputtering process generates a high-energy, wide-area plasma at the target. This process results in an even deposition rate, better target illumination and higher target utilization compared to traditional sputtering techniques. It also minimizes deposition non-uniformity due to arc discharges, since the higher power level and more uniform energetics of HITACHI E-102 sputtering can minimize the tendency for arcs to occur. In addition to precise angle adjustment and centerline tilt, E-102 offers repeatable, preset arc configuration and is capable of running at high power, up to 20 kW, depending on the target material. This allows for higher deposition rates. HITACHI E-102 also includes a built-in cooling unit and power supply, making it easier to setup and maintain. E-102 control machine includes a web-based interface for remote control and monitoring of processes and status from anywhere in the world. This allows for easy optimization of sputtering process parameters. HITACHI E-102 also features a patented showerhead target support tool, which allows for the deposition of thin films of varying thickness without need for repositioning the target. This asset means that E-102 can deposit thin films in the range of a few nanometer to several microns in thickness, with great precision. HITACHI E-102 is also highly reliable, due to the sturdy stainless steel chamber design and the high quality components used in the model. The vacuum chamber's close shield is designed to protect the work surface and the optically clear chamber wall to help prevent contamination. Overall, E-102 is an advanced sputtering equipment specifically designed for thin-film deposition. It utilizes an innovative pulse DC sputtering process to deposit high-quality and uniform thin films with the highest uniformity and lowest roughness available. The preset arc configuration, adjustable mount, and built-in cooling system make maintenance and optimization of the process easier. And the showerhead target support unit allows precise thin-film deposition without the need for repositioning the target. Altogether, HITACHI E-102 is a versatile and reliable sputtering machine for depositing high-quality thin films with great precision and repeatability.
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