Used HITACHI E-201 #293816627 for sale

HITACHI E-201 sputtering equipment is a state-of-the-art tool for thin film deposition. It is designed for versatility, enabling users to deposit thin films of various materials with great accuracy and uniformity. It is an ideal choice for a variety of applications, such as the production of thin film structures for thin film transistors, magnetic thin films, interconnects and contact layers for MEMS/NEMS sensors, optical thin films, and other multi-layer thin film structures. E-201 sputtering system utilizes unbalanced magnetron sputtering for thin film deposition. This method of sputtering is considered to be among the highest-quality thin film deposition processes available, providing the highest range of film thicknesses and greater uniformity over large areas. This feature makes it quite suitable for production of high quality thin film devices. HITACHI E-201 sputtering unit includes a powerful but user-friendly control panel that allows users to set parameters for process control. It also includes easy-to-use thin film deposition accessories and a "recipe" controller for repeatable, accurate thin film deposition. The machine is equipped with an active digital temperature controller that provides precise and consistent temperatures for uniform thin film growth. In addition, the tool also employs a pressure gauge to measure the pressure inside the chamber during the deposition process. This important feature helps to ensure optimal film growth conditions, maximizing the deposition rate, and ensuring uniform compositions. E-201 sputtering asset includes a vacuum model with a high-quality four-vane turbo-molecular pump that enables the user to achieve excellent deposition results quickly and reliably. Also included is a reliable external rotating-target assembly that allows users to change target material without vacuum pumping. The rotating-target assembly also enables target materials not compatible with RF sputtering to be used with HITACHI E-201 sputtering equipment. E-201 sputtering system also includes a remote-controlled gas injector for precise gas flow control. This feature ensures high uniformity of the films, allowing users to achieve the highest quality thin films. The unit also boasts multiple configurations for target material, allowing for a variety of materials to be deposited. In addition, the process control library that is included with HITACHI E-201 sputtering machine provides users with easy and reliable operation. The library details the control settings that are required for depositing thin films of various materials. This library can also be expanded with custom recipes for depositing films with specific properties for each application. E-201 sputtering tool is a versatile and reliable tool for thin film deposition, providing users with high quality films in an efficient and reliable manner. It offers a complete sputtering solution, combining the flexibility and accuracy of unbalanced magnetron sputtering with the reliability and repeatability of a well-designed asset.