Used JUANT TECHNOLOGY JUT-SHX-3032 #9112373 for sale
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ID: 9112373
CIG Sputter
Ultimate pressure: 24 Hours < 8.0 E-6 torr
Pressure rise value: ≦ 5x10^-3 torr liter/sec
Pump down time: 60 min < 5 E-5 torr
Work pressure: 1~15 mtorr
Thickness U%: ≦ 5%
Temperature U%: ≦ 5%.
JUANT TECHNOLOGY JUT-SHX-3032 is a state-of-the-art sputtering equipment designed for industrial thin film deposition. This system utilizes a unique process of using metal or dielectric targets to sputter, or convert, a variety of materials into a thin film of atoms and molecules. JUT-SHX-3032 provides precise process control and maintains high deposition rates, allowing for superior thin-film production with a high degree of repeatability. Its automated capability allows for smooth deposition operation while its intuitive control unit simplifies process setup and operation. At the heart of JUANT TECHNOLOGY JUT-SHX-3032 is its powerful Multi-Chamber Sputtering Machine, which uses three high speed targets and four separate sputtering guns to deposit materials onto the substrate. The targets are powered by the tool's dual-phase, triple-phase and gap-phase power supplies. Each of the four sputtering guns are independently adjustable, providing the user the ability to deposit specific materials onto specific locations on the substrate. JUT-SHX-3032 is equipped with a cryogenic hold for low-temperature material processing. This cryogenic chamber is temperature-controlled and maintains a uniform temperature, not more than 1.5 degrees Celsius, reducing impurities and maximizing quality and yield. The chamber features a unique, patented Dual-Substrate, or double-sided, technology that allows users to deposit material on two substrates simultaneously. This allows for even deposition and eliminates variability in the substrate. In order to ensure quality and repeatability, JUANT TECHNOLOGY JUT-SHX-3032 utilizes state-of-the-art process monitoring and control systems. This includes real-time Adjustable Process Impedance Control which adjusts material saturation to ensure uniform deposition, as well as Temperature Insulated Asset to maintain the optimal temperature of targets and components. Additionally, JUT-SHX-3032 has the capability to deposit Ceramic Targeting materials. Its Ceramic Targeting Model is designed to enable the deposition of Silicon Nitride, Silicon Oxide and other Ceramic materials with high precision and accuracy. Overall, JUANT TECHNOLOGY JUT-SHX-3032 is an advanced sputtering equipment with high-precision process control and excellent repeatability. Its sophisticated engineering design allows for superior thin-film production with a high degree of uniformity and consistency. And with its versatile capabilities, JUT-SHX-3032 is perfect for industrial thin-film deposition.
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