Used KDF 654i #293748451 for sale

KDF 654i sputtering equipment is a state-of-the-art sputter deposition tool that provides superior layer uniformity and deposition rate control. The sputtering system consists of two sputter cathodes, two 6" diameter planar targets, and two 5" x 8" substrates. The sputter cathodes are powered by three independent direct current (DC) power supplies - two DC current supplies and one DC voltage supply - providing a total power of 135 kW. The sputter ion beams generated by the sputter cathodes are directed downward toward the substrate table using two long-life magnetic field detectors. 654i sputter deposition tool also contains an advanced controller that enables precise control of the sputter parameters, such as the ion beam energy, sputter rate and layer homogeneity. The in-situ substrate temperature control unit (TCS), which utilizes embedded thermocouples, ensures high uniformity of both single and multi-layer films. The substrate table of KDF 654i sputtering machine is equipped with a sophisticated Interlock Tool (ILS) that allows substrate movement and positioning in both X-Y and angular directions. The substrate table is also capable of tilt adjust to +/− 20 degrees for uniform film adhesion. 654i sputtering asset allows the deposition of a wide range of material, from metals and alloys to compound semiconductors and dielectrics. The in-situ cleaning model utilizes a novel remote plasma cleaning process, which is highly effective for removing oxides, organics and other surface contaminants. The platform is complete with process monitoring systems such as infrared pyrometers, X-Ray Fluorescence Analysis (XRF), and Fourier Transform Infrared Spectroscopy (FTIR) for real-time monitoring of layer properties. KDF 654i sputtering equipment also contains a high vacuum turbomolecular pumping station and a mass flow controller, allowing the user to precisely control the internal environment. To ensure high quality deposition, 654i sputtering system includes automated process control tools such as In-situ Process Monitoring (IPM) and NEXUS™ sputter monitoring capabilities. This allows users to monitor various process variables including the deposition rate, film composition, layer uniformity, and sputter erosion. Overall, KDF 654i sputtering unit is a high-tech sputtering tool with a wide range of capabilities that facilitate high quality and highly uniform thin film deposition. With its sophisticated controller, interlock machine, in-situ cleaning, and process monitoring systems, 654i provides excellent layer properties and process repeatability.