Used KHF ATN 500B #9070912 for sale
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ID: 9070912
Vintage: 1995
Sputtering system
ZNS
Chamber
Standard electronics rack
RF Power supplies
(2) Circular targets, 10"
Sputter etch back mode
Manual shutter
1995 vintage.
KHF ATN 500B is a desktop-sized sputtering equipment designed for the deposition of thin film materials. This system is used to create metal, ceramic, and semiconductor thin films that are used in a variety of applications including coatings, semiconductor devices, and biomedical implants. The unit features a compact, modular design optimized for the deposition of these materials onto substrates such as silicon, glass, and plastic. It utilizes a vertical, 5-inch diameter stainless steel deposition chamber and a digital, direct-drive power supply coupled with a process controller. The machine is capable of sputtering a variety of materials such as metals, oxides, and nitrides. The materials are loaded into a ceramic target holder, which is attached to the power supply. The power supply provides a controlled current to heat the target, which in turn causes ions and neutral particles to bombard the target and be kicked off the surface at high velocity. These ions and particles then travel through the deposition chamber, where they strike a substrate placed on the opposite side of the chamber. This creates a thin film of the material on the substrate. The tool also features a computer-controlled process controller. This allows the user to precisely adjust parameters such as chamber pressure, power level, gas flow rates, and material deposition rates in order to achieve the desired results. The user can also program in recipes for automated depositing, which allows for consistent repeatable results. The asset comes with a mass flow controller for introducing reactive gases such as oxygen and nitrogen into the model. When combined with the sputtering process, these gases can create materials with unique properties such as high corrosion resistance, refractive index, or ferromagnetic characteristics. The equipment also includes cooling and thermal management options, allowing the user to accurately and precisely control the rate of heat dissipation. This ensures that the quality of the thin film being deposited is not compromised due to overheating. The system is highly configurable, and can be tailored to the specific needs of the user. For example, it can be fitted with a variety of additional components to further refine the deposition process such as a dopant source, a rotatable substrate holder, and a stage heater. The unit is an ideal solution for depositing thin film materials in a variety of industries. It is user-friendly, efficient, and reliable, with proven results. The machine is also relatively compact, making it suitable for laboratory, pilot, and production-scale applications.
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