Used KURT J. LESKER PVD 75 #293616035 for sale
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ID: 293616035
Thin film deposition system
Process chamber:
D-Shaped, 304 SS
O-Ring sealed, hinged, Al front access door
Viewport
Deposition shield
Pumping port
Process port
Gauging port
Instrumentation port
Vacuum pump:
Turbo pump, 260 L/s
Base pressure: 5x10^-7 Torr
Mechanical roughing pump, oil-sealed, 5.7 CFM
Foreline trap
Mist eliminator
Roughing valve
Vacuum gauging:
Ion gauge: 10^-10 Torr
Pirani vacuum gauge range: 10^-10 Torr
Frame work:
Fully enclosed cabinet: 47" x 35" x 75"
Integrated power distribution
Leveling pads
Water distribution manifold:
Manual shut off valves
Interlocked flow switches
Cryopump compressor
NPT Connector, 1" (Inlet / Outlet)
Options:
MAGNETRON Sputtering sources
Sputtering source power supply
Electron beam evaporation source
Thermal evaporation source
Low temperature evaporation source
Ion source
Substrate fixture
Substrate heating
Upstream pressure control
Film thickness monitor and controller
Computer controller
Recipe driven computer controller
Manual included
Power supply: 230 VAC, 50 Hz, Single phase, 30 A, 3-wire.
KURT J. LESKER PVD 75 is a cutting-edge sputtering equipment used for thin-film deposition processes that can create physical vapor deposition (PVD) coats from almost any pure metal or ceramic material. This system is highly efficient and is capable of producing high-quality thin-films with precise thickness control, excellent adhesion, superior reproducibility, and superior uniformity. The principal components of the unit are the sputter chamber, the vacuum chamber, the target holder and the power supply. The sputter chamber is an enclosure with two facing stainless steel plates that can be configured for a variety of sputtering techniques such as co-sputtering and reactive sputtering. The sputtering process is initiated in the sputter chamber by an ionized discharge created using a radio frequency (RF) or direct current (DC) power source which heats the target material while controlling the energetic particles. The vacuum chamber consists of a cylindrical chamber within which the pressure is maintained to as low as 2x10-3 Torr, enabling deposition of very thin films on almost any substrate material. Additionally, the vacuum chamber features a gas inlet and outlet to control the atmosphere during the deposition process. The target material is exclusively held by the target holder which is constructed from a combination of aluminum and stainless steel with the capability of accommodating targets up to 150mm in diameter. The target holder is adjustable and uses azimuthal angles and tilt angles to ensure optimal sputtering angle and maximum sputtered material per length of film. PVD 75 utilizes a higher power and higher frequency AC power supply than lower-end sputter systems for increased deposition rates, improved film thickness uniformity, and improved particle bombardment and charge accumulation on the sputtered film. This allows the deposition process to be carried out at a faster rate, enabling uniform thin films to be deposited on substrates at ? speed rates of up to 9-Sccm. In conclusion, KURT J. LESKER PVD 75 is a highly efficient, user-friendly sputtering machine used for thin-film deposition processes. This tool offers excellent uniformity, precise thickness control, superior reproducibility, and superior adhesion due to its principal components, the sputter chamber, the vacuum chamber, the target holder, and AC power supply.
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