Used KURT J. LESKER PVD 75 #9218896 for sale
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ID: 9218896
Vintage: 2011
Thin film deposition system
Base system:
PVD 75 Base deposition system
Process equipment options:
MAGNETRON Sputtering: (3) Torus 3-source flange assemblies
Sputtering source power supplies:
(2) KURT J. LESKER 300W RF With auto match network
KURT J. LESKER 1kW DC
Substrate fixturing:
Substrate fixture: (Top mount, base unit, add for options)
Primary rotation
Process gas inlet: Upstream pressure control
Film thickness monitor or control: Film thickness monitor
System control / Automation:
Recipe driven computer control
2011 vintage.
The KJL KURT J. LESKER PVD 75 sputtering equipment is a high-performance, industrial-grade thin film deposition system used for coating a wide range of materials. It utilizes physical vapor deposition (PVD) technology to deposit thin layers of metal onto a substrate, creating coatings that are durable, corrosion-resistant, and electrically conductive. The unit is capable of producing films from almost any target material, including stainless steel, titanium, copper, nickel, chrome, and more. PVD 75 has a source material chamber with a 2" diameter and a process chamber with a 2" diameter. The power supply for the source material chamber is provided through a variable frequency AC power supply, with adjustable output voltage and current, allowing for accurate control of the deposition rate. KURT J. LESKER PVD 75 uses an electrostatic-balanced shuttle plus a specially designed RF sputter gun which reduces the build-up of material on the substrate and increases deposition uniformity. An automated control machine provides precision control over sputtering parameters, including power, gas pressure, substrate temperature, and source material temperature. PVD 75 also features an onboard End of Deposition Sensor which monitors the performance of the sputtering process and provides automatic shutdown if the process is not running optimally. In addition to the built-in features, KURT J. LESKER PVD 75 also offers a range of optional accessories including a 2" diameter elemental source which allows the tool to sputter a variety of elemental target materials, and a high-performance rotary source which increases uniformity across the substrate. PVD 75 is also capable of depositing underlayers for adhesion improvement, protectant layers for corrosion resistance, and conductive metal layers. The asset is both versatile and powerful, making it an attractive choice for industrial sputtering operations. It is also easy to set up and operate, making it an ideal choice for those unfamiliar with sputtering systems.
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