Used KURT J. LESKER PVD 75 #9241893 for sale
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ID: 9241893
Thin film sputtering system
PVD Process chamber:
D-Shaped 304 SS, 24" high x 14" wide
Volume: 75 liters
Large access & replaceable view port
O-Ring sealed
Front access door
Flexible process ports
304L Stainless steel with 6061 aluminium hinged door
Vacuum pumping:
CTI-8F 1500 Cryopump
Compressor
3-Position pneumatic isolation gate valve
Touchscreen controller / PC Control
Oil-sealed mechanical rough pump: 5.7 CFM
Fore line valve
Dry roughing pump
Fore line trap
Mist eliminator
Roughing valve
Vacuum gauging:
Wide range vacuum gauge (Ion gauge & Pirani)
Mounting / Connection hardware
Adapters
Cabinet & framework:
Closed system support frame
Power distribution
Leveling pads
Cabinet construction carbon steel
Gray powder coat finish
Water manifold includes:
System components: Water distribution
Critical components: Interlocked flow switches
Shut off valves
NPT Connection, 1"
TEK-TEMP Recirculating water chiller, 6 gpm, 10000 Btu, 60 PSI
Sputtering source:
(3) MAGNETRON Sputtering source flange assemblies
(4) MAGNETRON Sputter cathodes
O-Ring sealed compression fittings: Source-to-substrate distance
Pneumatic driven deposition source shutter
Power supply:
KJLC 600 W RF Power supply with automatic matching network & control panel
(2) ADVANCED ENERGY DC Power supplies, 1.5 kW
Rack mount kits & connection cables
Top mounted custom substrate:
Single substrate, 12"
20 rpm
Stainless steel substrate holder:
Diameter: ¼"
High substrates: ¼"
Substrate heating & control:
Temperature: 350°C
Quartz Lamp / Resistive element
Process gas inlet / Upstream pressure control:
(2) MKS 1179 Flow controllers
MKS Baratron 626A Pressure transducer, 100 mTorr
Vent & purge pressure regulators
Film thickness monitor and optional control:
Quartz Crystal thickness monitor with single crystal head
Manual system control:
Touch screen controller: Button pump down & vent
Valves & shutter assemblies
Manual front panel control of power supplies
Switches
Full automatic process control
Graphical User Interface (GUI):
Vacuum screen display: Valve position & pump status
Vacuum status
Deposition screen:
Indicate shutter position
Deposition source status
Source material & target life log
Gas screen:
Mass flow controller modes
Indicate gas valve status
Display of pressure control settings & values
Motion screen display & input:
Speed & velocity profiles
PID Control parameters
Cooling screen: Water flow switch interlock status
Heating screen: Heater set points & control parameters
Turbo pump pressure (CDE): 5 x 10^-7 Torr
Power distribution:
Single service drop: 208 VAC, 30 A, 1 Phase
Component wiring: Centralized power distribution panel
EMO Protection
Safety interlocks
Power supply: 208 VAC, 3 Phase, 60 A.
The KJL KURT J. LESKER PVD 75 is a sputtering equipment in the physical vapor deposition (PVD) product family. PVD 75 offers a diverse range of deposition, etch, and oxidation applications. It is designed to handle large substrates of up to 12 inches in diameter. The modular design of the sputtering system allows it to be adapted to applications easily and cost-effectively. KURT J. LESKER PVD 75 features a seven-degree unified tilt angle, enabling flexibility for high-performance applications. The use of KJL's Evactron plasma cleaning technology ensures precise treatment of wafers and substrates, resulting in high yields. The unit's automated process control machine enables rapid and repeatable production processes. PVD 75 also includes a high-precision thermal imaging tool for uniformity control. The thermal imaging asset enables the characterization and optimization of the deposition process. The model also offers an optional variable pressure feature that allows for greater control over the deposition process. KURT J. LESKER PVD 75 has a robust vacuum chamber, vacuum pump, and exhaust equipment, all optimized for process repeatability. The vacuum chamber features a titanium-aluminum-ceramic composite construction, maximizing performance and reliability. The system also includes a vacuum-gas-venting adapter which allows for manual venting of the chamber. PVD 75 is designed for operation in a Class 1,000 clean room environment. The unit includes a range of user-friendly features, including a touchscreen operator interface, intuitive user menus, and process recipe selection. The machine is also compatible with a range of TCP/IP networking protocols, allowing remote operation of multiple KURT J. LESKER PVD 75 units. Overall, the KJL PVD 75 is an advanced sputtering tool, designed to meet the needs of the most demanding deposition and etch applications. The asset's modular design allows for flexibility and cost-effectiveness, while its automated process control model ensures precise and repeatable production processes. The equipment also offers a robust vacuum chamber, pump, and exhaust system, together with a range of user-friendly features, enabling easy operation and control.
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