Used LEAN 200 GEN 2 #9138139 for sale
URL successfully copied!
Tap to zoom
ID: 9138139
Sputtering system
Magnetron sputter source
NCT carbon deposition source
Confined plasma source
ICP etch source
HALO etch source
High temperature heater
Dynamic cooling source
RF deposition source
Triatron source
Multi-layer source
Process station: 4 to 24+
Maximum throughput: >1000
Simultaneous two-sided sputter deposition
MDP-250B source.
LEAN 200 GEN 2 sputtering equipment is an advanced form of physical vapor deposition technology. It is designed to enable scientists and engineers to deposit thin layers of materials onto substrates for use in a variety of precision applications. The system is capable of building extremely thin films with exceptional uniformity, allowing advanced particles to be trapped and used in a variety of processes. 200 GEN 2 unit uses electron beam (EB) techniques to deposit a variety of metal-based films on substrates. These films have superior uniformity compared to traditional sputtering techniques. This uniformity allows for precise control over the processes and enables the deposition of extremely thin layers. Additionally, the machine can deposit a variety of metals, including aluminum, copper and nickel. The tool also contains several features that make it an ideal choice for precision applications. The asset includes an advanced two-stage electron gun that allows for current control, with the ability to adjust the current for an optimized process. Additionally, the model provides a wide selection of process conditions, enabling precise control over the deposition rate and film properties. It also includes a temperature-controlled substrate holder for uniform film deposition. The equipment's advanced control capabilities also allow it to be used in hybrid sputtering, a technique that combines physical vapor deposition and chemical vapor deposition techniques. This enables the system to deposit thin layers of metals that are far thinner than what would be possible with physical vapor deposition alone. Overall, LEAN 200 GEN 2 sputtering unit is an advanced form of physical vapor deposition technology that provides unsurpassed performance and uniformity control. Its advanced capabilities and advanced control features make it ideal for precision applications. Its ability to mix two different physical vapor deposition techniques allows it to deposit extremely thin films of metals of superior uniformity.
There are no reviews yet