Used MRC 603 II #9102669 for sale

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MRC 603 II
Sold
Manufacturer
MRC
Model
603 II
ID: 9102669
Sputtering System Parts system Process in DC mode: Al, Ni and Ti AE DC MDX power supply AE RFX 3000 power supply Vacuum controller: non-functional Not included: Hydraulic pump Cryo on chamber 208 V, 100 A, 60 Hz, 3 Ph.
MRC 603 II is a compact, automated high-performance sputtering equipment designed to deposit thin films of metallic or dielectric material onto various substrates. It utilizes radio-frequency (RF) power supplies to generate a high-power RF field which ionizes a noble gas mixture containing the target material to be deposited. The sputtered material then collides with the substrate, forming a thin film coating. This system is ideal for applications requiring a high rate of materials deposition, including industrial production and research and development applications. MRC 603-II is equipped with a highly reliable, closed-loop process control unit for precisely controlling both deposition rate and thin film thickness. The machine features two independent RF power supplies deliver a maximum of 200W per plasma, and seven independently controlled targets and substrate holders for multilayer thin film deposition. Its robust, stainless-steel design is housed in a compact and portable enclosure, making it ideal for laboratory and production use. The tool is designed for operation in a single chamber asset, supporting either a single targets or multiple targets in rotation for multi-layer deposition. It accepts substrates of up to 8" in size and up to 4" in thickness in either a heated or a non-heated configuration depending on the target material. 603 II also features a vacuum management model to ensure a high-vacuum environment of up to 5x10-7 Torr. The equipment is designed to be flexible, offering multiple sputtering processes including DC, pulsed-DC, dual frequency, or RF. It also offers user-friendly software for easy setup and monitoring of the process parameters, as well as post-deposition analysis. 603-II is a powerful and reliable sputtering system suitable for a wide range of thin film deposition applications. With its compact design, flexible operation modes, user-friendly software and efficient process control unit, it offers a cost-efficient way to obtain high-quality thin films for various applications.
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