Used MRC 603 III #9012739 for sale

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Manufacturer
MRC
Model
603 III
ID: 9012739
Sputtering system RF: 1.5 kW DC: 10 kW PSI Air: 80-100 PSI Water: 60-90 (4) GPM (3) Target chromes Aluminum SiO² 15" x 5" Cryo pump compressor Booster pump Maximum processing size: 315 x 315 mm Vacuum system Cryo pumped CTI Cryo Torr 8 LEYBOLD D60A Roughing pump Load lock Target size: 4 3/4" x 14 7/8" (3) DC Cathodes Substrate heaters DC Power supply Keyboard CRT Monitor Targets shape: Square Compressor and RF generator RFPP RF20S Power supply Rated power output: 1500 Watts Matching network Controller: Analog closed-loop control Monitored by micro computer Substrate pallet size: 13" x 13" Pallet carrier: Chain drive Speed adjustable: From 39.3"/min to 120"/min Quartz substrate heater adjustable to 600°C Inset DC cathodes Facility requirements: Water: 4.0 gpm, 70 psig, 60°F Air: 70-100 psig, filtered, 1 cfm Sputtering gas: 3-5 psig Power: 208 V, 100.0 A, 60 Hz, 3-Phase.
MRC 603 III is a sputtering equipment designed to deposit thin films on substrates. The system is composed of a high-vacuum chamber, an external controller, and an embedded target source with two sputtering sources. The two sputtering sources are coaxial magnetrons, a planar magnetron and a dome magnetron. The substrate is mounted in the center of the chamber, and the two sputtering sources are positioned around the target surface. The planar magnetron has a planar surface for material sputtering, while the dome magnetron has a circular target surface and can be used for directional sputtering. MRC 603-III unit employs a vacuum process for the deposition of thin films on substrates. A sputtering gas, such as argon, is introduced into the chamber, where the pressure is maintained at a low vacuum of less than 10-4 torr. The argon atoms are accelerated and collided with the target material, causing particles of the target material to be sputtered onto the surface of the substrate. The process is called sputtering deposition, and is capable of producing smooth, uniform coatings of very thin films on a variety of substrates. 603 III also includes onboard power and operation controls. The embedded controller has a power supply, an adjustable-frequency power supply, and an array of control and monitoring capabilities. The machine is designed to operate at base pressure and provides temperature control for the target and the substrate. It also supports variable process parameters, allowing for optimization of sputter yields and processing times. The tool is designed to be simple to operate and provides advanced process control features, such as recipe-based process automation, real-time data logging, and reporting capabilities. The embedded software allows for full integration with factory automation systems, simplifying operation and eliminating costly downtime. 603-III is a versatile and reliable sputtering asset capable of producing thin films of uniform quality on a variety of substrates. The advanced process control features, combined with the reliable and repeatable performance of the sputtering model, make MRC 603 III an ideal choice for multiple thin film deposition applications.
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