Used MRC 603 #293774499 for sale
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ID: 293774499
Wafer Size: 12"
Sputtering system, 12"
GASONICS L3510 Microwave plasma asher
Deposition, 4"
Compressor for cryo pump
Does not include rough pump.
MRC 603 sputtering equipment is a sophisticated and versatile thin film deposition tool commonly used in the semiconductor industry for creating high-quality thin films with precise control over film thickness, composition, and uniformity. This system utilizes magnetron sputtering technology, a widely adopted physical vapor deposition (PVD) technique for depositing thin films on substrates by sputtering material from a target onto a substrate surface. Key components of 603 sputtering unit include a vacuum chamber, magnetron sputtering sources, power supplies, gas delivery machine, substrate holder, and control tool. The vacuum chamber provides an environment with low pressure to prevent contamination and enable efficient sputtering process. The magnetron sputtering sources, typically made of a target material like metals or oxides, are responsible for generating plasma and ejecting material atoms onto the substrate. The power supplies supply the necessary electrical power to the sputtering sources for plasma generation and ionization of the gas. The gas delivery asset in MRC 603 allows for precise control of the gas composition and pressure within the vacuum chamber, enabling reactive sputtering processes where a reactive gas is introduced to create compound thin films. The substrate holder is used to securely hold and position the substrate during the sputtering process, ensuring uniform deposition across the substrate surface. The control model of 603 sputtering equipment regulates and monitors various process parameters such as deposition rate, target power, gas flow rate, and substrate temperature to achieve desired film properties. One of the key features of MRC 603 sputtering system is its ability to deposit a wide range of materials including metals, alloys, oxides, and nitrides with high precision and repeatability. This unit offers flexibility in film composition and thickness by allowing the use of different target materials and sputtering conditions. Additionally, 603 provides excellent film uniformity and good adhesion to the substrate, making it suitable for various applications in the semiconductor, optoelectronics, and magnetic storage industries. MRC 603 sputtering machine is equipped with advanced safety features to ensure reliable and safe operation. These features include interlocks, vacuum monitoring systems, overpressure protection, and emergency shut-off mechanisms to prevent accidents and protect the user and equipment. Regular maintenance and calibration of the tool are essential to maintain its performance and extend its operational lifespan. In conclusion, 603 sputtering asset is a powerful tool for thin film deposition, offering precision, versatility, and reliability for a wide range of applications in the semiconductor industry. With its advanced capabilities and user-friendly interface, this model is a valuable asset for research and development, production, and quality control of thin film materials.
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