Used MRC 643 #293660538 for sale

MRC 643 is a computer-controlled pulsed dc-magnetron sputtering equipment designed for both thin film and etching applications. It is designed to provide high-quality, uniform thin-film deposition and controllable etching in vacuum conditions. The system is capable of sputtering up to four substrates or wafers simultaneously with a wide array of coating materials. 643 features a unique split-load design which greatly increases the versatility of the sputtering unit. Individual substrates can be loaded into each split module and then the modules can be brought to the same conditions, allowing for rapid switching between targets and substrates. This decreases production time and maximizes the efficiency of the sputtering machine. MRC 663 uses a cryogenic magnetron sputtering cathode. This provides a non-ionized environment which allows the deposition process to be performed without the risk of charge buildup or buildup of reactants. The process pressure generated by the cryogenic magnetron is optimized for sputtering of a wide range of coating materials. The tool also features a 3-stage variable power supply which can provide a wide range of sputtering powers from 1-50 kW. This allows for precise control of the sputtering rate and the thickness of the deposited film. The asset also features a multichannel reference generator which allows for precise control of the chamber pressure and sputtering gas flows. MRC 643 also features a load-lock model which allows substrates to be loaded into the chamber with minimal exposure to air. This maintains the cleanliness of the chamber and minimizes the chances of contamination of the deposited films. The equipment also features an automatic evacuation cycle to reduce the operating pressure to the specified level. Finally, 643 is also provided with a PC-controlled graphical user interface for simplified control and monitoring of the sputtering process. This interface provides easy parameter setting, monitoring of process conditions, and complete access to the system's history data. This interface also provides feedback data on media flow, chamber pressure, and power delivery, allowing for complete control of the sputtering process.