Used MRC 643 #293741512 for sale

MRC 643 is a magnetron reactive sputtering equipment used for selective thin film deposition. The system comprises of a plasma source, which is a 3-chamber magnetron, a remotely programmable power supply, an external controller board, and a high-precision rotational stage. The magnetron chamber, also known as the substrate chamber, houses the sputtering target magnet, as well as the substrate table. The substrate table is capable of accommodating two substrates up to 200 mm in diameter and 50 mm in height. The plasma source consists of a 300 mm diameter circular magnetron target, with a 32-pole design, which is capable of producing a uniform magnetic field between the inner and outer surfaces. The external controller board is designed to interface the power supply and associated programs to the sputtering target. This board is fitted with a range of temperature sensors, along with a pressure transducer and resistance temperature detector. The sputtering target is composed of a graphite source and a silicon source, both of which are housed in the magnetron chamber. The graphite source is a metal oxide that is vapor and oxidized by an electrically heated filament located at the bottom of the chamber. By generating a helium based flow around the filament, the metal oxide is carried away from the magnetron target, preventing any build up of the oxide. The silicon source is an alumina-coated silicon carbide material that is heated to a controlled temperature. The power supply is capable of providing a 1000 watt power output to the two sputtering targets in the unit. It also supports a number of programmable applications including, adjusting the mechanical rotational stages, voltage and current, as well as controlling panel functions. The machine also provides an ion gauge which can measure the working pressure in the chamber during sputtering processes, allowing for precise control of process parameters. 643 is a highly advanced sputtering tool, designed to achieve the highest levels of selectivity, uniformity and process reproducibility. The rigorously tested parameters, as well as the advanced sputtering technology makes the asset well-suited for mission critical sputtering applications. It is highly recommended for research and development, semiconductor and display manufacturing, energy-efficient materials and other advanced sputtering applications.