Used MRC 643 #83146 for sale

MRC 643 is a multi-chamber sputtering equipment designed to deposit thin films through physical vapor deposition (PVD). This advanced deposition system offers reliable and reproducible PVD processes for a wide variety of customers. 643 has six process chambers: three load locks, a transfer chamber, a load chamber and a production chamber. Special alloy construction, from stainless steel and anodized aluminum, provides extremely durable and consistent chamber wall surfaces to support superior deposition results. The unit also includes a unique active cavity pumping technology, which enables fast and efficient processes for a wide range of applications. This inert, ultra-high-vacuuming machine combines five separate vacuum pumps, such as a turbo molecular pump and a diffusion pump, to control the pressure in each of its processes with accuracy, stability and peace of mind. All six chambers separate, allowing them to be cleaned and precisely processed separately, while maintaining pressures and vacuums. The load chamber and the transfer chamber also have a loadlock, allowing different processes to take place even while the load chamber is occupied. The production chamber is equipped with a variety of process technology components. It has a 40 kW capacitively coupled RF (13.56 MHz) generator designed to quickly increase the powered sources without causing arc-over. There are two 20" sputter power supplies for generating high power levels, and two 2" sources for lower powering and sputter cleaning. A 18-target, 4" cluster tool provides flexibility for a wide variety of applications, along with multiple reactive ion etching (RIE) and physical vapor deposition (PVD) capabilities. The proprietary design of MRC 643 reduces the complexity of the sputtering tool. The alignment of the sources and the ability to control them from a single point simplifies the maintenance and operation procedures. The entire asset is easy to integrate into existing production facilities, aiding in improving productivity and efficiency. To summarize, 643 is a high performance multi-chamber sputtering model designed to deposit thin films through physical vapor deposition (PVD). With six chambers, a 40 kW RF generator, two 20" sputter power supplies, two reactive ion etching (RIE) and physical vapor deposition (PVD) capabilities, it is perfect for a variety of applications. Additionally, the active cavity pumping technology ensures fast and efficient processes, while proprietary design simplifies the maintenance and operation procedures. All these features of this advanced deposition equipment make it highly reliable and reproducible.