Used MRC 643 #9004057 for sale

Manufacturer
MRC
Model
643
ID: 9004057
Sputtering system P/N: 82023-000C Target size: 5 x 15 80-100 psi Air 60-90 psi Water (4) GPM 3 kW RF, 10 kW DC Power supply: 208 V, 100 A, 60 Hz, 3-Phase.
MRC 643 is a high-performance physical vapor deposition (PVD) sputtering equipment that allows users to deposit thin films with extreme accuracy on a variety of substrates. 643 utilizes a high-vacuum system and sputters target materials on the substrate with a production rate of up to 10 nanometers/second, which can increase productivity and efficiency while reducing material costs. Its unique design features 6 independent tilting sputtering gun units, which allow for increased flexibility and customization of the deposition process and makes it possible to deposit different materials simultaneously with excellent uniformity. MRC 643 includes a variety of features such as an integrated loadlock chamber, chamber recirculation, an automated substrate cleaning process, a temperature-controlled environment, and a fully CAD/CAM compatible operating unit. The machine is designed for industrial use and includes a wide range of integrated features to maximize accuracy and dependability. The unique cooling tool helps to extend the life of the target materials and reduce maintenance costs. The asset can be tailored to meet specific customer needs and allows for a wide range of deposition rates, target sizes, target-to-substrate distances, and different target materials. The model is also designed to be compatible with a variety of substrates such as wafers, solar cells, flash memory, and substrates with complex shapes, making it the ideal choice for R&D and production applications. 643's control equipment, EZ-Dep 2, is designed to optimise the deposition process with a user-friendly graphical interface. This allows users to set process parameters, monitor deposition parameters, and adjust sputtering parameters in real-time in order to achieve greater accuracy and control. MRC 643 provides users with a reliable and repeatable process for depositing thin films on a wide variety of substrates while maximising productivity and cost efficiency. Its unique design, advanced features, and user-friendly control system make it the ideal choice for industrial sputtering applications.
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