Used MRC 822 #293604301 for sale

MRC 822 is a high performance deposition equipment for sputtering materials onto substrates. It is an advanced piece of equipment which has been designed for use in the semiconductor industry, allowing for the deposition of both positive and negative charge carriers with high yields. The system contains four active sputtering guns, which may be configured to enable multi-layer deposition. The Chamber is constructed from stainless steel, providing a vacuum tight enclosure of up to 1.0 x 10-6 torr. Its orientation is horizontal, with a working diameter of 300mm. It is controlled using a Graphical User Interface (GUI), which is easy to use and has an intuitive navigation unit. The machine can be operated in manual, semi-automatic and fully automatic modes, giving the user the ability to configure and control the deposition parameters as and when needed. The position of the substrate is adjustable, and may be moved around both the x and y axes. The temperature of the materials being sputtered may be monitored during the deposition process and accurately maintained within a pre-defined range. 822 operates at a high pressure differential, with maximum pressure of 1.0 torr. To ensure uniform deposition of materials onto the substrate, the sputtering guns are configured and angled to create a uniform sputtering environment. This helps to reduce the risk of deformation of the substrate due to charging effects. MRC 822 provides reliable operation and excellent sputtering yields, and is suitable for the sputter-depositing of materials onto silicon wafers, substrates, and other engineering and scientific materials. It is ideal for the deposition of advanced semiconductor devices, such as microelectronics, photovoltaics, and micro-optics.