Used MRC 8667 #9239313 for sale

MRC 8667 is a versatile DC/RF sputter deposition equipment produced by Applied Materials. This deposition system is designed for semiconductor industries as it uses a rotatable thermal shield to combine multiple processes in a single unit. This machine provides precise process integration, uniform coating, optimal throughput and high uptime. The tool features a large (2.3m x1.0m x1.5m) chamber and advanced integrated hardware, including a quartz showerhead, rotatable thermal shield, cryopump, base pressure monitor and eight-channel process controller. The thermal shield enables up to four wafers to be sputter coated simultaneously in the same module, reducing the total sputter time by up to 70%. Additionally, the base pressure monitor and advanced integrated hardware enable the asset to maintain optimized settings, such as temperature, pressure, and RF power, which results in superior film characteristics and excellent uniformity. 8667 model offers a high degree of flexibility and is capable of single or multiple RF powers, precise and repeatable deposition of a wide variety of films at different targets and powers, and multiple recipes with varying duty cycles and gas flows. The use of separate chamber components for the shower and substrate ensure minimal maintenance with fast turn-around times. Moreover, the equipment is designed to conserve energy, meaning it produces nearly zero emissions and requires less than 1.3kW of power over a 1.2m2 footprint. MRC 8667 also includes cutting-edge process control software for precision management of user-defined processes. This software enables users to monitor, control, and modify the sputter process. Users can also access software-based sputter deposition packages to maximize performance on complex applications, such as silicon-on-insulator sputter deposition and metal-oxide-semiconductor fabrication. In conclusion, 8667 sputtering system is an advanced sputter deposition unit that provides precision process integration, uniform coating, optimal throughput, and high uptime. Furthermore, its integrated hardware and process control software give it a high degree of flexibility, allowing for precise and repeatable deposition of a wide variety of films with varying gas flows and duty cycles. The machine is an ideal solution for semiconductor industries looking to maximize performance on complex applications.