Used MRC 902M #9199362 for sale

Manufacturer
MRC
Model
902M
ID: 9199362
RF Sputtering system (2) Targets.
MRC 902M is a fully automated sputtering equipment designed with precise control over sputter deposition and superior maintenance and safety features. It features a parallel arrangement of three highly adjustable magnetron sources. Its large chamber, extensive process flexibility, cleanliness and accessibility makes it suitable for research and development of various materials including metallic, ceramic, or composites. 902M has a process chamber with two 150mm (6")diameter cathodes and one 100mm (4") diameter cathode. Each one is independently adjustable for height, angle of incidence, rotation, and field strength of the magnet and can accommodate various materials and different thickness of films. The magnet configurations are adjustable to optimize presence angle for even film coverage and pulse to control deposition rates. The design of the process chamber includes an ultraclean loadlock, twin evacuation valves, ballast bottles, and the chamber door that protects the interior from contaminants. The 5-port exhaust system delivers rapid pumping and high pressure uniformity. The unit is equipped with a powerful control console for machine operation, which allows users to configure complex processes, adjust parameters while the tool is in operation, and monitor multiple aspects of the asset in real-time. It has a user-friendly interface and powerful online monitoring, alarming, and diagnostic features. Additionally, the programmable PID controller enables automatic operation with user-defined settings. MRC 902M is a versatile sputtering model equipped with superior safety features. These features include high temperature alarms, pressure control interlocks to prevent high/low pressure errors, and process heat alarms. The efficient filtration equipment consists of a 99.97% efficient HEPA filter, replacesable carbon filter, and pre-filter. 902M is a versatile and reliable sputtering system that allows precise control over deposition of materials. Its powerful features and easily adjustable settings make the unit suitable for a wide range of research and development applications.
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