Used MRC 903 series #5708 for sale

MRC 903 Sputtering Equipment is a fully automated sputtering system designed to provide uniform, repeatable deposition of metallic, dielectric, semiconductor and superconductive material. It is an ideal tool for various applications such as flash memory metallization, semiconductor device metallization, mask coatings, magnetic sensors, optical coatings, and solar cell coatings. The unit covers the following steps: pre-sputtering stage, low-pressure sputtering stage, post-sputtering stage, and vacuum etching stage. For each step, total operation is optimized to get the highest throughput, including high-precision stage control with multi-axis stages, simultaneous multi-section sputtering, and heating/cooling hardware with sophisticated process monitoring and control functions. The substrate stage includes a advanced motion control machine for substrate movement with the real time closed loop control of enclosed sputter time and chamber pressure. It also uses an electron beam heating function to provide uniform temperature distribution. Furthermore, the stage comes with a E-beam evaporator that can be used for multi-directional sputtering and even for process steps like etching and cleaning. The E-beam evaporator can also be used for controlling sputter rate and thickness uniformity by controlling the substrate temperature and vacuum level. The tool's magnetron sputtering technique allows for sputter deposition of insulators, conductors and semiconductors onto irregular and small area substrates. The sputtering process is done using three magnetrons with a wide angular range. The sputter rate can be controlled through various parameters such as plasma power, chamber pressure and gas flow. The asset is fully equipped with software designed to manage recipes and customize the parameters necessary to achieve an efficient sputtering process. For post-sputtering stage, MRC 903 has a built-in cooling model designed to prevent deposition of an undesirable amount of material, allowing a better control of the deposition process. The vacuum etching stage utilizes an Atomic Force Microscope capable of accurately controlling the level of etching and allows for precisely controlling the pattern shape, depth, and material thickness of the deposition. MRC 903 can serve for both R&D and production and the automated sputtering process leads to a high degree of control, shorter cycle times and improved yields. It is an ideal equipment for a wide range of applications due to its flexibility and reliability.