Used MRC 943 #9155815 for sale

MRC 943 is a sputtering equipment designed for processing single wafers up to 8" and having pulse reverse sputtering capability. This system features a load-lock and mechanism that can transport the wafers to either an octagon sputter chamber (4.5" to 8") or a quad chamber (applicable to 4" to 4.5" wafers). The two chambers can be operated independently or in sync, supporting a wide range of process possibilities. In the octagon chamber, the magnets can be rotated to adjust the degree of Ar gas ion bombardment on the target, which is a key factor in the deposition rate. Both chambers employ a thermoelectric cooling unit to maintain a constant temperature in the area above the substrate. The sputter gun power supply module contains an output of up to 2.5kW of direct current (DC) and up to 1kW of radio frequency (RF) power for pulse reverse sputtering. The multi-component cathodes have up to three sputter sources, allowing particles of different compositions, sizes, and preferentially directed particles depending on the target-to-substrate distance. This allows the deposition of alloys with their various physical and chemical properties to be tailored. The base unit of 943 is equipped with a control interface that displays real-time process information and status. The machine employs a feedback loop to enable autonomous wafer-to-wafer process repeatability, and can be programmed for use in multiple recipes. This enables the end user to pre-program the tool for multiple processes and schedule them for operation without the need for manual input. MRC 943 also features a gas control asset with up to five gases for reactive sputter deposition, and also includes integrated scrubbers in both chambers to increase safety and reduce the model's environmental footprint. A dynamic mass spectrometer installed in the octagon chamber also enables the use of process monitoring techniques such as in-situ monitoring to ensure process repeatability and consistency. In summary, 943 sputtering equipment provides an advanced, reliable process platform for sputtering single wafers of up to 8". The system features efficient cooling and process control, as well as safety, environmental and monitoring features.