Used MRC 943 #9227138 for sale

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Manufacturer
MRC
Model
943
ID: 9227138
Sputtering system Compressor Mech pump System hardware: MRC Load lock assembly CTI CT-8 Cryo pump: Load lock Process chamber (3) SIERRA Scientific planar 5"x15" cathodes (3) Target shielding sets ADVANCED ENERGY MDX-10 DC Power supply: 10 kW MRC Hivac valve With MRS throttle valve assembly (3) MKS MFC MKS 390 Baratron assembly MRC Hydraulic system Etch: ENI OEM-12A RF Generator ENI Matchwork 10 RF Matching unit Rack hardware: GOULD / MODICON PLC Controller GP-303 IG Controller MKS 252 Throttle valve controller MKS 247 MFC Controller: 4 Channels (5) GP-275 Convectrons TCR DC Voltage power supply (MRC Rail bias).
MRC 943 is a sputtering equipment used to deposit thin films on a substrate surface. It works by bombarding a target material with high-energy particles to remove a small section of the target and deposit it onto the substrate. The system comprises of a vacuum chamber housing the sputtering source and a target cathode, a vacuum pumping unit for maintaining a low pressure environment, a set of power supplies for controlling the electrical currents and a process temperature controller. The target is typically made out of a variety of materials including metals, alloys, ceramics, and minerals. It is typically heated to a high temperature to increase its sputter yield. The high-energy particles used to sputter the target material can come from either a magnetron source or an RF source. The process can be carried out at a wide range of pressures to control the rate of deposition. The vacuum environment inside the sputtering chamber helps to maximize the yield of sputtered material by limiting the number of competing reactions that can potentially occur. The pressure is typically maintained below 1 millitorr,a pressure measurement unit. The process temperature can also be regulated through a temperature controller, which allows the sputtering process to occur at a much higher rate. In order to control the electrical currents applied to the substrate and target, the machine utilizes a set of power supplies. The power supplies can be programmed to deliver either constant or pulsed current operating modes. In the constant mode, the power supply can deliver a continuous uninterrupted electrical current to the target and substrate material, allowing an even deposition across the substrate. In the pulsed mode, the power supply can switch the electrical current on and off rapidly, allowing for a highly-controlled deposition. 943 is a highly efficient and precise tool for deposition of thin films on substrates. Its high sputter yield and precise temperature and pressure control make it an ideal sputtering asset for a wide range of applications including semiconductor and solid-state device fabrication, microelectronics, optics, and flat panel display production. With its efficient operation and robust design, MRC 943 is an ideal model for reliable and repeatable film depositions.
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