Used MRC Mark II #9230625 for sale

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MRC Mark II
Sold
Manufacturer
MRC
Model
Mark II
ID: 9230625
Wafer Size: 8"
Vintage: 1996
Sputtering system, 8" 1996 vintage.
MRC Mark II is a sputtering equipment, used in vacuum deposition processes to deposit thin films of metal, semiconductors and other materials onto substrates. It is widely used in many industries such as aerospace, automotive, biomedical, plastic and nanotechnology. Mark II consists of two main parts: a vacuum chamber and a power supply. The chamber is sealed and allows a background pressure of 1 x 10-6 Torr, which can be further reduced with a turbo-molecular pump. It also contains a load-lock, which is used to load and unload substrates from the chamber under vacuum. The power supply is a high voltage DC power source with variable settings on both forward and reverse current. It is connected to the vacuum chamber via multiple electrodes, which can be adjusted in order to tailor the plasma. The system allows for different types of sputtering processes, including reactive, dc magnetron, and RF diode. In reactive sputtering, reactive gases such as Argon and O2 are introduced into the chamber to react on the target material. DC magnetron sputtering is a process in which a permanent magnet is used to create a whirling, rotating plasma of accelerated ions, acting on the target material. Finally, RF diode sputtering is a process in which RF power is applied to an inductively coupled plasma to create an ionized atmosphere and bombarding ions to sputter away thin films onto substrates. In addition to the basic sputtering setup, the unit also offers additional features, such as a high-resolution vision machine for precise placement of substrates onto the target, high-precision temperature control for substrate heating, and multiple substrate configuration capabilities. For added safety, the chamber is equipped with explosion-proof lighting, fume-control devices, and a gas-tight seal. Overall, MRC Mark II is a versatile tool for sputtering which offers great flexibility and precise control over the deposition process. It is especially suited for industries that require high-performance coating solutions with low defect rates.
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