Used MRC Planar #129081 for sale

MRC Planar
Manufacturer
MRC
Model
Planar
ID: 129081
Sputtering target for sputtering systems Al, 5N purity Bonded to water jacket.
MRC Planar is a type of high-performance sputtering equipment. It utilizes a Planar magnetron source to create deposition from a target material onto a substrate. This system is designed to generate uniform, repeatable and precise thin film deposition. The unit consists of the magnetron sputtering source, a vacuum chamber, and a power supply. The magnetron has a flat target with permanent magnets on the back and the face close to the substrate. The target is held in place by a vacuum chamber which separates the chamber atmosphere from the target material. The power supply provides the necessary voltage and current to the magnetron. The voltage and current are optimized to get the desired sputtering rate. The magnetron sputtering source is operated with an internal magnetic field. This creates ionized particles which are then accelerated towards the target. As the particles impact the target they transfer their energy in the form of heat and cause the target material to sputter into the vacuum chamber. The ionized particles are accelerated across the substrate at an adjustable rate, which is optimized for the device being fabricated. The vacuum chamber is a sealed glass cylinder with gas inlets and controlled by an external vacuum pump. It is used to separate the chamber atmosphere from the target material and to prevent contamination from outside sources. The machine is highly versatile and is suitable for a wide range of applications such as thin film deposition for high-performance devices, solar cells, and displays. It is very efficient and provides uniform coverage that is difficult to achieve with other techniques. Moreover, its robust construction and modular design provide a reliable and repeatable film deposition process. The tool can be customized for specific applications and offers efficient sputtering for a variety of materials. It can be used for various coating processes and grants a high level of control over the deposition rate and uniformity.
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