Used NANOMETER M6500 #9058585 for sale

NANOMETER M6500 is a high-end sputtering equipment used in the creation of highly precise NANOMETER-scale films and devices. Sputtering is the process of atomically depositing material onto a surface using a combination of high vacuum, bombardment with large currents of electrons, and application of a magnetic field. The vast majority of modern sputter systems are of the magnetron type, in which an alternating current is applied, causing electrons to accelerate into a magnetron chamber. M6500 is a fully automated sputter system that allows users to precisely control the sputter deposition parameters. The unit includes an advanced controller with multiple setup profiles, allowing users to quickly adjust deposition conditions. It also features an internal cooling machine, allowing the tool to run efficiently and reliably for long periods of time. The asset includes two types of sputter guns, an RF and a diode style sputter gun, allowing for more flexibility when controlling material properties. Additionally, the model allows for customized deposition rates and dielectric properties, allowing for deposition of a wide range of materials. NANOMETER M6500 is well suited for a variety of applications, including thin-film deposition, sputter etching, deposition of radioactive materials, and materials with different compositions. The equipment is designed to be useful in even the most sensitive research and development settings where precise control is of the utmost importance. Its advanced controller and multiple setup profiles enable up to four simultaneous applications to be run simultaneously. Additionally, the system's design ensures that the applied currents and voltages are kept to a minimum and that any hazards are minimized. All in all, M6500 is a reliable and highly precise sputter unit that provides users with the means to create highly precise nano-scale films and devices. Its advanced controller and multiple setup profiles, along with its efficient cooling machine, ensure that the highest degrees of accuracy and control are maintained when conducting deposition processes.