Used NEXX / TEL / TOKYO ELECTRON APOLLO XP #9137393 for sale

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ID: 9137393
Wafer Size: 6"
Vintage: 2014
PVD System configured for manual tray processing, 6" Manual front end Load lock degas with (1) roughing pump Deposition chamber capacity for 5 magnetrons lOkW power supply (2) 8" Cryo pumps M4 Magnetron for Au, Ti, TiW and Pt Ni Loop Magnetron for Ni SECS/GEM 2014 vintage.
NEXX / TEL / TOKYO ELECTRON APOLLO XP is a sputtering equipment designed to deposit thin films of material on a substrate. The system consists of a vacuum chamber with a pumping unit, a source of the sputter deposition material, and a substrate holder. The pumping machine is designed to evacuate all air from the chamber to a desired level of vacuum to prepare the environment for the sputter deposition process. A two-stage turbo molecular pump is used to help ensure that the desired level of vacuum is achieved. Once evacuated, the chamber is then purged with nitrogen gas to provide a clean and stable environment for the deposition process. The source of sputter deposition material is typically a thin layer of metal or alloy, which is then vaporized and deposited onto the substrate. The material source is typically contained inside a crucible inside the chamber, which is then heated to a high temperature to vaporize the material. Once vaporized, the material is then ejected from the crucible by a magnetron source, in which an electrical current is used to create a magnetic field. This magnetic field ejects the vaporized material from the crucible, causing it to spray across the substrate. The last component of the tool is the substrate holder, which is used to hold the substrate in place and allow for accurate and consistent deposition of the material. The substrate is typically held in place by a jig made of stainless steel or copper. This jig is designed to be adjustable to accommodate a variety of substrates, and also facilitate the precise deposition of the material. These three components form TEL APOLLO XP asset, and when combined provide an effective and reliable means of depositing material onto a substrate. The model is capable of depositing thin films of metal and alloy material with a high degree of accuracy and repeatability. This makes it an ideal tool for a wide variety of applications, including optical coating, semiconductor processing, and medical device fabrication.
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