Used NRC / VARIAN 3117 #19408 for sale

NRC / VARIAN 3117 sputtering equipment is a comprehensive deposition system for the physical vapor deposition of metallic and insulating material layers. It is designed for a variety of applications including coatings for microelectronic and optoelectronic devices, thin film transistors, magnets, and other advanced structures. With its dual-gun design, this unit is capable of producing uniform and smooth deposition over large areas. NRC 3117 features advanced arc suppression technology that results in excellent process repeatability and reliability. This technology features a uniform ion emission cone with a narrow sheet of electric field lines to prevent the occurrence of electric arcs and sparks. Its four separate target positions, advanced RF power supplies and controllers, and integrated rotary motion and cooling capabilities enable it to efficiently deposit statistically uniform layers over large areas. VARIAN 3117 is compatible with virtually any type of material, including metals, semiconductors, insulators, and high-k dielectrics. Its modular design allows for a variety of substrate sizes and shapes, enabling the manual or automated control of substrate shape and position for optimal results. Its reloadable cassettes and onboard cleanroom facilitates quick tool reconfiguration and tight process control. The machine also features sophisticated process control with electronic Rotation Control (ECR) technology that allows for precise rotation of the source wafer and stage positions. This technology produces uniform layers and argon ion beam cleaning for specific metal, carbon, and other elements. The tool also offers advanced process monitoring and feedback systems for automated deposition and cleaning cycles and for improved process repeatability. Its recirculation asset and bidirectional baffle model prevent the contamination of the outgoing flux and the entrance of particulate matter during the deposition process. 3117 sputtering equipment is an ideal solution for emerging technologies requiring high-precision, high-throughput deposition of clean and uniform metal or dielectric layers. Its advanced productivity-oriented features make it an attractive choice for a variety of applications, ranging from advanced microelectronics to medical devices.