Used OERLIKON / UNAXIS Clusterline 200 #293802334 for sale

OERLIKON / UNAXIS Clusterline 200 is a highly advanced sputtering equipment designed for thin film deposition in various industries such as semiconductor, solar, and optical coatings. This sputtering system utilizes a cluster tool architecture, enabling high throughput and flexibility in deposition processes. UNAXIS Clusterline 200 is renowned for its precise film thickness control, uniformity, and reproducibility, making it an ideal choice for high-volume production environments. At the heart of OERLIKON Clusterline 200 unit are the multiple process chambers integrated within a single platform. This architecture allows for parallel processing of multiple substrates, significantly enhancing productivity and efficiency. Each process chamber is equipped with its own independent sputtering target and power supply, enabling different materials to be deposited simultaneously or sequentially on the substrates. The machine also features load-lock chambers for substrate loading and unloading, ensuring minimal downtime between deposition runs. Clusterline 200 is equipped with state-of-the-art sputtering sources, such as magnetron sputtering and reactive sputtering, providing a wide range of deposition options for various materials and film properties. The sputtering targets are typically made from materials like metals, oxides, and nitrides, offering versatility in thin film deposition applications. The tool can achieve high deposition rates and precise control over the film thickness, composition, and structure, meeting the stringent requirements of modern thin film technologies. Moreover, OERLIKON / UNAXIS Clusterline 200 incorporates advanced process control features, such as real-time monitoring of key parameters like deposition rate, power consumption, and gas flow rates. These capabilities enable operators to optimize the deposition process, resulting in high-quality thin films with excellent uniformity and repeatability. The asset also offers recipe management software that allows users to store and recall process parameters for different deposition recipes, streamlining the setup and operation of the model. In terms of substrate handling, UNAXIS Clusterline 200 is compatible with various substrate sizes and types, including wafers, glass panels, and flexible substrates. The equipment can accommodate both standard and custom substrate sizes, providing flexibility for diverse production requirements. Additionally, OERLIKON Clusterline 200 is equipped with advanced substrate heating and cooling capabilities, enabling precise temperature control during the deposition process to optimize film properties and adhesion. Clusterline 200 sputtering system is designed with a focus on high reliability, ease of maintenance, and safety. The unit features robust vacuum pumps, advanced plasma diagnostics, and automated cleaning routines to ensure optimal performance and uptime. Maintenance tasks such as target replacement, chamber cleaning, and machine calibration are designed to be user-friendly and minimize downtime, maximizing the productivity of the tool. In conclusion, OERLIKON / UNAXIS Clusterline 200 is a versatile and advanced sputtering asset that offers high-throughput thin film deposition capabilities for a wide range of applications. With its cluster tool architecture, advanced sputtering sources, precise process control, and substrate handling capabilities, UNAXIS Clusterline 200 is a top choice for manufacturing high-quality thin films in production environments requiring high productivity and reliability.