Used PERKIN ELMER 2400-6J #35438 for sale
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ID: 35438
Wafer Size: 6"
Vintage: 1970
RF Sputtering system, 6" targets
Bias sputter - RF Sputter mode
Target & Mode selection
Shutter position selector
(3) 6" Diameter assembled cathode stations
6" water cooled substrate stage
Optional gases
Automatic RF Tune Network
RF Power Stabilizer
Time Power Control
Start/Stop System Control
Henrey 1KW RF Generator
Lift & Swing sputtering head hoist
CTI Cryo Torr 8 with 8300 Compressor
Sargent Welch Mechanical Pump
Documentation Package
No DC Bias
Runs on 1 Kw
Missing load lock chamber
As is, where is
1970 vintage.
PERKIN ELMER 2400-6J sputtering equipment is a versatile, high-precision tool used for thin film deposition. Its power and precision make it an ideal choice for thin film applications such as optical thin film coatings, MEMS and scanning electron microscope (SEM) chip processing and wafer scale interconnects. This sputtering system is designed for the deposition of metals, including aluminum, chromium, tantalum and tungsten, as well as oxides and nitrides of these metals. The modular design of 2400-6J allows for versatility in optimizing thin film deposition processes to meet specific requirements. It includes a high-capacity chamber, which is capable of processing up to 8, 24 or 48 wafers simultaneously. This high-capacity unit also allows for multiple layers to be sputtered onto a single substrate in one process. The high power, multiple magnetron and planar sputter sources included with this machine provide even and fast deposition rates of thin films. The tool has an easy-to-interpret graphical user interface, making it user-friendly, with multiple windows that provide comprehensive process control packages. A set of preset recipes allows easy set-up and repeatability of results. The asset is also able to monitor and control the sputtering parameters in real time, allowing for quick process optimization. The model has a number of features which promote efficient operation of the sputtering process. These include a gas management equipment, which allows for efficient management of the reactive and non-reactive gases used for deposition; a vacuum management system, which enables more controlled, elevated vacuum; and an automated wafer handling unit, which provides easy and fast wafer loading and unloading. In order to ensure the highest degree of reproducibility and repeatability, PERKIN ELMER 2400-6J has a number of safety features. These include an over- temperature safety switch, automatic interlock operation and monitoring of the chamber temperature and pressure. This machine also has a number of post-process controls, such as measurement of crystal orientation uniformity, surface quality and smoothness. 2400-6J is an ideal solution for those requiring a high-precision sputtering tool capable of delivering high-quality thin film deposition processes. Its versatile design and intuitive control asset, along with its range of safety and post-process control features, make it the perfect choice for applications ranging from optical thin film coatings to MEMS processing and more.
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