Used PERKIN ELMER 2400-8J #153594 for sale

ID: 153594
Load lock sputtering system, (4) targets.
PERKIN ELMER 2400-8J is a versatile sputtering equipment used in a wide range of applications, from physical vapor deposition (PVD) to precision thin film deposition. It features a powerful and robust sputtering source and is capable of producing high-quality thin films quickly and efficiently. The system also features a modular design that allows for easy customization and upgradability. 2400-8J utilizes a magnetron sputtering source, which provides superior control and uniformity over other kinds of sputtering. This is due to the fact that it utilizes a magnetic field to direct the material being sputtered in a specific direction. This directional deposition is ideal for achieving the desired deposition thickness within specific regions of the substrate. Moreover, this sputtering unit is also equipped with a rotating substrate holder, allowing for even and complete coverage of the target substrate. PERKIN ELMER 2400-8J offers a variety of process parameters, such as gas flow rate, target material, deposition uniformity, and process speed. By carefully adjusting these parameters, the user is able to tailor the characteristics of the material being deposited according to their needs. This is ideal for industries that require the highest degree of precision and control over the deposition process. In terms of safety, 2400-8J provides a highly reliable and secure machine, as it is fully grounded and utilizes a vacuum chamber. This chamber helps to minimize dust and particle contamination, as well as protect samples and equipment from damage and reduce the risk of fire. Furthermore, it features a variety of controls that enable the user to monitor the process and prevent any accidents. Overall, PERKIN ELMER 2400-8J provides a reliable and efficient sputtering tool that can be used in a variety of applications. Its robust source and well-thought-out safety features make it an ideal choice for precision thin film processing and deposition.
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