Used PERKIN ELMER 2400-8SA #98401 for sale

ID: 98401
Wafer Size: 6"
Vintage: 1980
Sputtering systems, 6" (3) 8" Round RF Diode Cathodes Annular Table 21.5" O.D. Variable Speed Drive Motor Anode Cathode Spacing RF Power 1 & 2 kW Servo Match Auto Tune Load & Tune Functions RF Forward & Reflected Meters Target Selector Mode Selector Shutter full circle design Shutter position selector Auto Pump Sequencing Cryo Pumped Hoist for Sputter Head Other options available No DC bias Runs on 2 Kw Missing load lock chamber Currently installed 1980 vintage As-is, where-is.
PERKIN ELMER 2400-8SA sputtering equipment is an advanced piece of equipment designed to deposit thin films of materials on substrates of various shapes and sizes. The system is easy to use and can deliver exceptional results due to its tightly controlled environment and specifically designed components. The unit is designed with a High Vacuum Chamber which is effective for 1E-8 torr (1.3 x 10^-5 Pa). This chamber is fitted with individual plasma cathode ports for three independent sources, as well as a port for the insertion of substrates. The cathodes are made from titanium-tungsten alloys, and multiple systems can be integrated for extended deposition periods. The machine is equipped with an OS-500 cryogenic high-vacuum pump, providing excellent high-vacuum levels for deposits ranging from ultra-thin films to thicker ones. The strong magnetic field generated by the high-power sputtering target source ensures uniform particle bombardment on the substrate surface. The tool is also equipped with a 25kV ion gun that provides exceptional beam-target interaction and uniform film deposition. The asset's High Performance Data model allows users to monitor and adjust parameters such as substrate temperature and pressure, current, voltage, and deposition rates. This allows users to achieve exacting deposition specifications and optimize film characteristics. In addition, the equipment can be integrated with additional components to achieve a variety of sputter deposition processes, such as magnetron sputtering and reactive sputter deposition. 2400-8SA sputtering system is one of the most advanced systems for deposition of thin films and other materials. The unit's tight control of parameters and multiple components allow for the deposition of films of varying thicknesses and specifications, giving users unequaled accuracy and precision. The machine is also capable of being used for reactive sputter deposition, magnetron sputtering, and more, making it incredibly versatile and suitable for a variety of deposition processes.
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