Used PERKIN ELMER 2400 #9272966 for sale

Manufacturer
PERKIN ELMER
Model
2400
ID: 9272966
Sputtering system Round targets, 8" RF Diode cathodes RF Generator Mechanical pump LEYBOLD 450 Turbo pump.
PERKIN ELMER 2400 is an advanced physical vapor deposition (PVD) equipment designed for uniformly sputtering thin films on large substrates or multiple small samples. This system is a reliable and cost-effective solution designed to meet the needs of both research and production laboratories. 2400 sputtering unit is based on direct current unbalanced magnetron technology, which guarantees superior physical and electrical properties of thin films with excellent surface uniformity. It offers comprehensive deposition parameters such as temperature control, high concentration ratios, and radio frequency enhances sputtering. The machine is composed of a process chamber, a six-axis manipulator for the substrate, a clustered source of magnetrons, a deposition material source, a cooling tool, on-board metrology devices, a vacuum subsystem, and a console with software interfaces and user-friendly hmi's. The asset enables the deposition of various thin film materials, including precious and non-precious metals, alloys, oxides and dielectrics, in a wide range of thicknesses. It enables the selection of multiple substrate shapes and sizes, from small components to very large substrates. It offers high area uniformity and smooth surfaces, as well as a uniform power density and thickness of material deposition. The model also provides high throughput and cost-effective deposition with a low cost-per-unit production rate. PERKIN ELMER 2400 offers superior control and monitoring capabilities. It is capable of monitoring the thickness of the deposited film, which is essential for controlling the quality of the material. The equipment can also monitor the composition of the deposited material, allowing for complete control of the deposition process. Furthermore, the system offers user-friendly controls, including parameters such as film thickness, uniformity, temperature, RF input, and etch rate. The unit can also be used to automatically control deposition rate and film thickness, as well as to adjust the deposition rate and substrate temperature. Overall, 2400 sputtering machine offers superior performance and cost-effective thin film deposition for various applications. It offers superior thin film uniformity and superior thin film adhesion, making it a highly reliable and cost-effective solution for research and production facilities.
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