Used PERKIN ELMER 4400 #293585638 for sale

PERKIN ELMER 4400 sputtering equipment is a high-performance tool for depositing thin films and coatings onto semiconductor substrates for microelectronic and optoelectronic applications. It is a single-wafer loadlock system that is equipped with an RF or DC sputter source and a standard and dual-zone electron Cyclotron Resonance (ECR) plasma etch source. It has a sample chamber that accommodates up to two wafers, comparable to the wafer sizes of 4, 5, and 6 inches. It allows a vacuum range of up to 2 x 10 -5 Torr, a working pressure of 2 x 10 -4 Torr and a maximum sputter temperature of up to 500°C. The RF or DC sputter unit is equipped with a unique variable ion shielding/magnet-damping machine which allows the accurate monitor of deposition rate and profile. As a result, users can precisely monitor the film structure and requirements without having to manually adjust the distance between the wafer and the sputter source. The sputter source can be tilted to provide the best angle of incidence at the substrate surface. This ensures high-quality films with uniform thickness and excellent adhesion. The ECR source provides advanced plasma control capabilities for excellent etch selectivity, uniformity and anisotropy profiles. It offers a wide range of etch chemistries including reactive ions and non-reactive plasmas. Additionally, it supports high-rate ion sputter etching and provides a high chamber uniformity. The tool is equipped with a high-performance PC-based computer with a graphical user interface that lets users control the process and monitor parameters. It allows storing recipes for repeat performance and provides a high degree of process control, with fully integrated diagnostics. Overall, 4400 sputtering asset is an advanced sputter deposition tool that offers next-generation film deposition and etch processes for semi-conductor device manufacturing. It offers superior performance, accuracy and reliability, and allows users to obtain superior film quality with greater process flexibility and control.h