Used PERKIN ELMER 4400 #293769605 for sale
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ID: 293769605
Sputtering system
Load lock
(3) Sputtering targets, RF / DC
Etch station
(2) Gas micrometer flow сontrols
ADP Cryopump
LEYBOLD Direct drive pump
Center elevator feed-through is currently non-functional
RF Transmission line is currently non-functional.
PERKIN ELMER 4400 is a sputtering equipment used in thin film deposition processes. It is a PVD (Physical Vapor Deposition) system and uses plasma enhanced sputtering. It has two targets that can be sputtered simultaneously, and is capable of depositing multilayer thin film coatings. The unit also has an isolated chambers with an integrated pumping machine. The tool is equipped with a high-voltage power supply, providing up to 12kv and delivering up to 600 watts. It has two sputtering guns that ensure uniform deposition of the thin film coating. The targeted area size for each gun is 150mm × 150mm, and the film can range from 1nm to 365µm in thickness. The chamber of 4400 contains multiple turbo molecular pumps, as well as a diffusion pump, ensuring a pressure of 0.5 mbar or lower. This low pressure aids in uniform thin film deposition and also helps prevent oxidation of the thin film layer. The sputtering asset features an interactive touch screen control that enables the user to monitor, analyze and control the deposition process quickly and easily. It is also possible to save different recipes in the control unit in order to recall the sputtering parameters for future use. PERKIN ELMER 4400 is capable of depositing a variety of thin film materials, such as oxides, nitrides, carbides, and metals. It can also deposit carbide thin films with a thickness range of <10 micrometers. The model is certified to work with semiconductor materials of all types, and the sputtering speed is adjustable from 0.40 to 10.00 Angstroms/sec. It is also capable of adjusting the target power from 0 to 100%, ensuring an optimal deposition of the thin film layer. To ensure optimal performance, the sputtering equipment must be regularly maintained. This includes cleaning the chamber, dusting and lubricating the sputtering guns, and replacing any worn out parts. The maintenance guidelines must be closely followed as improper maintenance of the system can lead to poor film deposition quality or break down of the unit.
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