Used PERKIN ELMER 4400 #42927 for sale
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ID: 42927
Sputtering systems
With sputter etch capability
8" Round targets
Single gas
Includes:
Delta backing plate
Insulator
Dark space shield & magnet
(2) DC Magnetron assemblies
(2) DC Magnetrons
RF Diode assembly
Etcher
RF Generator, 1 kW
AE MDX-5, 5 kW DC P/S
MKS MFC: Gas control by controller
CT-8 Cyro pump with SC controller
Gas system:
MKS MFC With MKS 250 controller
SST Gas line with VCR connections
BARATRON With MKS-270 controller
G.P. 303 Dual ion guage controller
HENRY RF Generator 1 kW
AE MDX-5 5000w DC Power supply
Process chamber
CT-8 Cryo & SC Compressor.
PERKIN ELMER 4400 is a high-throughput sputtering equipment specifically designed for precision sample preparation. It is suitable for the production of high-quality thin films, particularly for advanced industrial applications, such as deposition of metals, metals alloys and oxides, as well as semiconductors on a variety of substrates. This sputtering system is equipped with a powerful 18 kW power supply, which enables depositing upto 2.5nm/min of material onto a substrate surface. Target holders are designed to easily accommodate up to 5 different targets. In addition, a sophisticated shutter mechanism ensures uniform deposition throughout the entire sample area, while providing automatic target exchange and minimum exposure to air or atmosphere. The sputtering process takes place within an enclosed magnetically-shielded chamber, preventing stray electrons from the target surface. This, in turn, leads to uniformity of the deposition and excellent film quality. An automated, programmable, batch control unit and real-time surface X-ray spectroscopic surface control allows for easy operation and control of the sputtering process, with performance parameters such as deposition time, current, temperature and pressure monitored and adjustable. The machine is well-suited for deposition of metals, metals alloys and oxides, such as aluminum oxide, gold, titanium oxide, tantalum oxide and etc. It is equipped with various deposition accessories, including an angled substrate chuck and quartz meandering unit, enabling deposition of films on difficult-to-reach substrates with a sharply controlled angle. In addition, an advanced sputter head allows high-throughput production of wafers or panels of variable sizes and shapes. 4400 offers superior performance and a number of advanced features, allowing its users to produce extremely thin films with excellent uniformity in minimal time. It is an ideal sputtering tool for commercial and industrial purposes.
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