Used PERKIN ELMER 4400 #9201790 for sale

Name: PERKIN ELMER 4400
Brand: PERKIN ELMER
SKU: 9201790
Availability: InStock

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Sputtering Systems

Manufacturer

PERKIN ELMER

Model

4400

ID: 9201790

Wafer Size: 6"

Sputtering system, 6" Wafer loading: Manual With load lock Cathodes: Circle shape, 8″ & 4 max Sputter methods: RF / DC Diode / MAGNETRON Gas lines: 1~3 MFC Options: Gas lines with MFC N2 O2 Customized Lamp tower alarm with buzzer: Mechanical pump / Dry pump for process chamber and load lock Independent mechanical pump / Dry pump for process chamber Chiller for cooling plates and table Turbo pump for load lock Load lock lamp heating function: Up to 200°C Chamber lamp heating function: Up to 300°C Plasma etch function Bias function Co sputter function Reactive sputter function Main frame 28" Diameter SST chamber top plate with ports and cathodes: Configuration 4400 4410 / 4450 Cathode shape Circle Delta Cathode size 8" Delta Cathode quantity 1 to 4 1 to 3 Sputter power supply: 4400 4410 / 4450 DC Power 5 kW 5 kW / 10 kW RF Power 1kW / 2kW 2 kW / 3 kW Pulse DC Power 5 kW 5 kW / 10 kW Process chamber: 8" Diameter x 12" High stainless steel cylinder with 6" CF Flange view port and load lock port 28" Diameter stainless steel base plate 11/2" Air operated roughing isolation valve Air operated gas inlet valve Air operated vent valve 11/2" Blanked-off leak check port Removable deposition shields 23" Diameter, 3-position water cooled annular substrate Table with variable speed motorized table drive Full circle shutter and vane shutter Chain drive pallet carrier transport Heavy duty electric hoist Load lock: 30" x 28" x 8" Stainless steel load lock chamber Aluminum cover Chain drive pallet carrier transport 2" Air operated roughing isolation valve Air operated vent valve 23" Diameter molybdenum annular substrate pallet Elevator for pallet up and down function Vacuum systems for process chamber: (2) Stage cryo pumps With 1000 l/s pumping speed for air Includes: Chevron Water cooled compressor and lines Automatic regeneration controller Plumbing kit, 71/2" Aluminum air operated gate valve: 6" ASA Air operated venetian blind throttling valve Mechanical pump or dry pump for process: 36.7 Cfm Chamber and load lock Replaced obsolete controls: Auto pump down controller Load lock controller Digital clock timer Table raise / Lower control Throttle valve control system Pressure control system Sputter head controls Gas line with MFC Ar, 200 SCCM, customized Power box: AC 380 V / 208 V / 3 Phase.

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PERKIN ELMER 4400 is a state-of-the-art sputtering equipment that has become a common versatile tool for thin film vacuum deposition. This sputtering tool is a multi-source system, allowing for sputtering any metal or dielectric material in its three-chamber design with its custom-engineered end-mount wafer holder. 4400 can achieve precision deposition thickness down to 1 angstrom and thin film uniformity down to 1 nanometer. This precision measurement is made possible with the patented copper target protection method that also ensures process repeatability as well as long cycle production times. Using TRIO-MIM^TM sealed magnetron technology guarantees non-contamination of the chamber during deposition of the thin film materials. The TRIO-MIM^TM sealed magnetron technology heats the sputtering target and thus additional potential to vary process parameters is opened. This allows for performance of high density, high conductivity films as well as more complex organic materials which require a higher substrate temperature during deposition. PERKIN ELMER 4400 is a reliable and easy to operate unit. This sputtering equipment offers flexibility in terms of the size of the wafer holder and the ability to adjust the sputtering parameters with real-time software control for greater process precision. Machine calibration is easily carried out using the built-in Auto-Calibration feature. It is also a robust enough tool for UL certified operation in production environments. In addition to its general deposition applications, 4400 is often used when creating advanced device components. It implements mechanical polishing of substrates to ensure smooth surfaces while the sputtering process creates fine micro-scale features on the devices. PERKIN ELMER 4400 is a reliable and efficient sputtering asset, offering partial and full-chamber sputter sputterings with optional in-situ deposition and annealing. The model's features allow for production of the highest quality thin films while controlling the cost of production.