Used PERKIN ELMER 4400 #9210436 for sale

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Manufacturer
PERKIN ELMER
Model
4400
ID: 9210436
Sputtering system Includes: Delta backing plate Insulator Dark space shield & magnet Load locked system: (3) Target heads capable: Holding (3) delta DC magneron assemblies Gas system: MKS MFC With MKS 250 controller SST Gas line with VCR connections BARATRON With MKS-270 controller G.P. 303 Dual ion guage controller HENRY RF Generator 1 kW AE MDX-5 5000w DC Power supply Process chamber CT-8 Cryo & SC Compressor.
PERKIN ELMER 4400 sputtering equipment is a high performance instrument used to deposit thin films of metallic, compound and hybrid compounds onto substrates. This sputtering system is a powerful tool for industrial, scientific, and academic research. 4400 uses magnetron and ion beam-assisted magnetron sputtering. Magnetron sputtering produces a homogeneous thin-film deposition, and is used for basic material deposition applications. The ion beam-assisted magnetron sputtering technique allows for greater film adhesion, giving a superior-quality film. Additionally, the ion beam-assisted magnetron sputtering technique is ideal for depositing conformal films which may possess high aspect ratios. The unit's power source is capable of providing five-target sputtering with precise current control, and excellent repeatability. The machine's 4-pocket loadlock tool increases deposition efficiency and throughput. The loadlock asset ensures the minimization of air-borne contaminants, and allows for stable base pressure. The software includes an advanced user interface which allows easy control of the process parameters. An advanced data logging model logs user-set parameters during operation, and also includes real-time deposition rate control. Also included in the equipment is a pressure monitor for monitoring environment pressure. PERKIN ELMER 4400 has a chamber diameter of 830mm with a chamber height of 368mm. The chamber is designed to provide a high degree of uniformity and compatibility with multiple materials. The system utilizes a unique pedestal design which reduces process heating, and improves communications between wafer and chamber. The unit also includes an advanced pumping machine which consists of two stages, both of which are designed to reduce tool transitions and decrease process contamination. The first-stage turbine pumps utilize double-staged seals to ensure a high degree of chamber cleanliness. The second-stage cryopumps freeze any remaining contaminants, rendering them inert. 4400 sputtering asset is an ideal choice for industrial-level thin-film deposition. Its combination of technologies and model enhancements ensures high-quality, compliant films with superior adhesion and excellent repeatability. This equipment provides researchers with a reliable and efficient way to explore and develop thin-film technologies.
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